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Parameter-efficient Large AI Model Co-inference at Multi-cluster Edge Networks
KTH, Skolan för elektroteknik och datavetenskap (EECS), Teknisk informationsvetenskap.ORCID-id: 0000-0002-0980-1395
Shenzhen University, College of Electronic and Information Engineering, Shenzhen, China.
ShanghaiTech University, School of Information Science and Technology, China.
Beijing University of Posts and Telecommunications, Beijing, China.
Vise andre og tillknytning
2026 (engelsk)Inngår i: ICC 2026 - IEEE International Conference on Communications, Proceedings, Institute of Electrical and Electronics Engineers (IEEE) , 2026Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

The increasing scale and computational demands of large artificial intelligence models (LAIMs) pose significant challenges for efficient inference among distributed devices in resource-constrained environments. This paper presents a multi-cluster LAIM co-inference framework in which an edge server, equipped with multiple graphics processing units (GPUs), coordinates user clusters to fulfill inference requests. We assume that devices within each cluster capture data from different perspectives, and then use on-device lightweight LAIMs to generate local features. The edge server collects and fuses these features to produce a more accurate inference result. To capture the fundamental trade-off between model pruning and co-inference performance under multi-device scenarios, we theoretically characterize the impact of pruning ratio and device contribution based on the rate-distortion analysis and partial information decomposition. Guided by the analysis, we then jointly optimize the pruning ratio, task scheduling, and transmit power to minimize inference distortion subject to the latency, energy, and capacity constraints. Extensive simulations demonstrate that the proposed framework achieves superior performance in comparison to existing baselines, offering improved inference quality and resource efficiency in multi-cluster edge environments.

sted, utgiver, år, opplag, sider
Institute of Electrical and Electronics Engineers (IEEE) , 2026.
HSV kategori
Identifikatorer
URN: urn:nbn:se:kth:diva-386492DOI: 10.1109/ICC59461.2026.11587850Scopus ID: 2-s2.0-105045349035OAI: oai:DiVA.org:kth-386492DiVA, id: diva2:2089911
Konferanse
2026 IEEE International Conference on Communications, ICC 2026, Glasgow, United Kingdom, May 24-28 2026
Merknad

Part of ISBN 979-8-3195-4209-0

QC 20260805

Tilgjengelig fra: 2026-08-05 Laget: 2026-08-05 Sist oppdatert: 2026-08-05bibliografisk kontrollert

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Totalt: 13 treff
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