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  • 1.
    Amin, Yasar
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Jamal, Habibullah
    Zheng, Li-Rong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Chip-package codesign of receiver front end modules for RF/wireless applications2005Inngår i: 2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, New York: IEEE , 2005, s. 767-770Konferansepaper (Fagfellevurdert)
  • 2.
    Amin, Yasar
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT. Computer Engineering Department, University of Engineering and Technology Taxila, Pakistan .
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Zheng, Lirong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    SoP design on liquid crystal polymer substrate for 5 GHz RF receiver front-end module2005Inngår i: International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System, 2005, s. 236-240Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents highdensity multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on liquid crystal polymer (LCP) substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.

  • 3. Chen, L.
    et al.
    Duo, Xingzhong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Zheng, Lirong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Lai, Z.
    Liu, J.
    Process development and reliability for system-in-a-package using liquid crystal polymer substrate2004Inngår i: Proc Electron Compon Technol Conf, 2004, s. 24-28Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.

  • 4.
    Duo, Xinzhong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Design and implementation of RF system-on package modules for short-range wireless communicaions2004Licentiatavhandling, med artikler (Annet vitenskapelig)
  • 5.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    System-on-package solutions for multi-band RF front end2005Doktoravhandling, med artikler (Annet vitenskapelig)
    Abstract [en]

    Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization.

    The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained.

    Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.

  • 6.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Torikka, Tommi
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Ismail, Mohammed
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    On-chip versus off-chip passives in multi-band radio design2004Inngår i: ESSCIRC 2004: PROCEEDINGS OF THE 30TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE / [ed] Steyaert, M; Claeys, CL, NEW YORK: IEEE , 2004, s. 327-330Konferansepaper (Fagfellevurdert)
    Abstract [en]

    This paper presents on-chip versus off-chip passives in multi-band radio design. The analysis is demonstrated through several multi-band low noise amplifiers designs in SiGe BiCMOS and GaAs PHEMT. Cost-performance trade-off analysis shows that when on-chip passives are moved off chip, performance of RF circuits is always improved. However, simple RF circuits do not show obvious cost-benefits, whereas complex RF circuits such as multi-band radio can have significant cost savings by using off-chip passives.

  • 7.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Torikka, Tommi
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Ismail, Muhammed
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Tjukanoff, Esa
    A DC-13GHz LNA for UWB RFID applications2004Inngår i: 22ND NORCHIP CONFERENCE, PROCEEDINGS, 2004, s. 241-244Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper, we present a 4-stage traveling wave lownoise amplifier for UWB RFID (ultra-wideband radiofrequency identification). This LNA covers a frequencyrange of DC - 13 CHz. The circuit is implemented with0.I5pm GaAs PHEMT chips embedded in flexible LCP(liquid crystal polymer) substrate. In the frequency range,the gain of the LNA is better than IO dB, fluctuation of thegain is less than 3dB, its noise figure is less than 4dB, SI 1and S22 are around -10 dB.

  • 8.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Ismail, Mohammed
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    On-chip versus off-chip passives analysis in radio and mixed-signal system-on-package design2004Inngår i: PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), NEW YORK: IEEE , 2004, s. 109-116Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Advances of VLSI and packaging technologies enable condensed integration of system level functions in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP, and eliminate constraints between chip and package, a complete solution is needed to co-design and co-optimize chip and package in a total design plan with precise trade-offs of on-chip versus off-chip passives. In this paper, we present a complete and systematic design methodology for RF SoP/SoC. This methodology includes early analysis and design implementation. This early analysis is to estimate the performance and cost of each solution quickly and quantitively. Then, the best solution is found and implemented. For a better presentation, the method and design techniques are demonstrated through the design of a common emitter low noise amplifier (LNA) for 5GHz wireless LAN (local area network). Analytical equations of noise figure and transducer gain for the LNA with lossy package are also developed.

  • 9.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Ismail, Muhammad
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    On-chip versus Off-chip Passives Trade-offs in Radio and Mixed-Signal System-on- PackageManuskript (preprint) (Annet vitenskapelig)
  • 10.
    Duo, Xinzhong
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Zheng, Li-Rong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Ismail, Muhammed
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    A concurrent multi-band LNA for multi-standard radios2005Inngår i: 2005 IEEE International Symposium On Circuits And Systems (ISCAS), Conference Proceedings, IEEE , 2005, s. 3982-3985Konferansepaper (Fagfellevurdert)
    Abstract [en]

    A source-degenerated cascade LNA, which works at 2.4GHz and 5.8GHz simultaneously, is designed for Bluetooth and IEEE wireless LAN 802.11 a/b/g receivers. In this design, 0.15 mu m GaAs PHEMT technology and embedded passives in MCM-D substrate are implemented. At 2.4GHz and 5.8GHz, this LNA provides 12.2dB and 15.3dB gain, respectively. Noise figures of the LNA are 0.53dB and 1.43dB, respectively. Good input matching and output matching are also achieved-S11 and S22 at both frequencies are less than -10dB.

  • 11.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Ismail, Muhammed
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Analysis of lossy packaging parasitics for common emitter LNA in system-on-package2004Inngår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, NEW YORK: IEEE , 2004, s. 75-78Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. As well, influence of lossy packaging parasitics on LNA is also analyzed.

  • 12.
    Duo, Xinzhong
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Ismail, Muhammed
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Broadband CMOS LNAs for IR-UWB receiver2005Inngår i: Norchip 2005, Proceedings, New York: IEEE , 2005, s. 273-276Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Two single-ended wideband LNAs for Ultrawide-band receiver have been designed and implemented in 0.18 mu m CMOS technology. The first one, a feed-back LNA, is a two-stage amplifier with a improved feedback loop, which provides high gain and enables the input port to match with 500 in a wide frequency range from 500MHz to 8GHz. The second one, an LC low-pass-filter matched LNA, employs a third-order low pass filter in the input port to match a frequency range from 3GHz to 8GHz. In both of the LNAs, the input stage is a common source amplifier. Inductive shunt peaking is used for maximizing the bandwidth and flatting the gain. In the feed-back LNA, measurements show that the maximum gain is 11.5dB, the 3-dB; bandwidth is from 500MHz to 7GHz, IIP3 is -2.2dBm at 4GHz, the minimum noise figure is around 5.7dB, S11 is less than 8.2dB, and the power consumption is 14mW. In the LC filter matched LNA, the 3-dB bandwidth is from 3GHz to 7.3GHz. The maximum gain is 9.6dB, IIP3 is 0dBm at 4 GHz, the minimum noise figure is 7.6dB, S11 is less than -13.4dB and the power consumption is 23mW.

  • 13.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    RF robustness enhancement through statistical analysis of chip-package co-design2004Inngår i: 2004 IEEE International Symposium on Cirquits and Systems - Proceedings, IEEE , 2004, s. 988-991Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs in SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.

  • 14.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu R.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    A study of packaging Requirements Multi-Band/Multi-Standard Wireless Chips2002Inngår i: Proc. IEEE 20th Norship Conference, 2002, s. 285-290Konferansepaper (Fagfellevurdert)
  • 15.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu R.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Chip-package co-design of common emitter LNA in system-on-package with on-chip versus off-chip passive component analysis2003Inngår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, NEW YORK: IEEE , 2003, s. 55-58Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper, we present common emitter LNAs (low noise amplifiers) in system-on-package for 5GHz WLAN application. Innovation of this module is that it is chip-package co-designed and co-simulated with performance trade-offs for on-chip versus off-chip passive component integration. It thus provides an optimal total solution for embedded RF electronics in system-level integration. Analytical equations for key performance parameters, noise figure and gain, of these LNAs are developed as functions of quality factors of passive components and the package parasitics. They hence provide designers a quantitative trade-off for on-chip versus off-chip passive components integration in SoP design. The final module is composed of on-chip active components in 0.5mum SiGe BiCMOS technology and off-chip passive components integrated in MCM-D substrate. Significant improvement in performance is found in these co-designed LNAs than those in single-chip LNAs.

  • 16.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu R.
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Modeling and simulation of spiral inductors in wafer level packaged RF/wireless chips2003Inngår i: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 34, nr 1, s. 39-47Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    In this paper, embedded rectangular spiral inductors on Wafer-Level Packaged (WLP) RF/wireless chips were studied with 3D (three-dimensional) EM (electromagnetic) simulations. The performance of spiral inductors fabricated with various geometrical and technological parameters was analyzed. It is shown that Q (the quality factor) and f(res) (the self-resonance frequency) could be improved by using the thick insulator layer and thick/wide metal line, which are fabricated by WLP technology. The value of Q could be over 60 at 20 GHz for such embedded components, attesting a significant improvement compared to the conventional on-chip counterparts in CMOS. Through this study, optimal structures for such components are identified and guidelines for design and fabrications are derived. Finally, a method to estimate the inductance of rectangle spiral inductors is developed. It is useful to determine the approximate structure of an inductor quickly before detailed 3D EM simulation, which may cost a long time.

  • 17.
    Duo, Xinzhong
    et al.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu R.
    KTH, Tidigare Institutioner                               , Mikroelektronik och informationsteknik, IMIT.
    Chen, Liu
    Zou, Gang
    Liu, Johan
    Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology2003Inngår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, s. 51-54Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper, we present a receiver front-end for 5 GHz wireless LAN in novel LCP (liquid crystal polymer) based system-on-package module. The module is based on embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. Furthermore, the novel LCP material shows excellent RF and microwave performance. The quality factors of key passive components such as inductors integrated in LCP substrate with thin film technologies is as high as 60. The insertion loss of the bandpass filter is 3dB. The conversion gain of the receiver front-end is 20 dB and occupies 8.7mm by 3.6mm area.

  • 18. Peltonen, Teemu
    et al.
    Shen, Meigen
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Koivisto, Tero
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tjukanoff, Esa
    Zheng, Li-Rong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    A 0.18 #x003BC;m CMOS Ultra-Wideband Low-Noise Amplifier with High IIP32005Inngår i: Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, s. 452-454Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper an ultra-wideband low-noise amplifier (LNA) for the frequency range of 3.1 - 9.4 GHz using 0.18 mu m CMOS RF process is introduced. Single-ended single stage LNA structure utilises an input LC-ladder, cascode transistor configuration and LRC-feedback to realise an ultra broad bandwidth response. In operating frequency range noise figure (NF) of 3.1 dB and gain of 10.6 dB were achieved along with high linearity (IIP3) even upto 10.9 dBm at 3.1 GHz. With the bias network, the LNA had a total power consumption of 31 mW from 1.8 V supply.

  • 19.
    Rodriguez Duenas, Saul
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Yamac, Sezi
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Ismail, Mohammed
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Zheng, Li-Rong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    CMOS UWB IR Non-Coherent Receiver for RF-ID Applications2006Inngår i: Circuits and Systems, 2006 IEEE North-East Workshop on, 2006, s. 213-216Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Ultra Wide Band Impulse-Radio (UWB-IR) bringsthe opportunity of increased bitrates in RFID systems. This paperpresents the implementation of a CMOS non-coherent UWBimpulse receiver targeted for readers in RFID applications. Thereceiver consists of an RF-front-end and an On-Off keying (OOK)10Mbps demodulator, which is implemented using a 0.18umCMOS process. The receiver works for 3.1GHz-5GHz, has asensitivity of -70dBm, and consumes 31mW from a 1.8V supply.

  • 20.
    Torikka, Tommi
    et al.
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Zheng, Lirong
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tjukanoff, E.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications2004Inngår i: 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, Vol. 2, s. 1687-1692Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper, we present a chip-package co-design of a concurrent low noise amplifier (LNA) in novel liquid crystal polymer (LCP) based system-on-package module for multiband radio transceivers. The module consists of a wideband LNA covering frequency range 1 GHz - 13 GHz and a multiband pass filter. By designing an appropriate multi-band passive filter, the wideband LNA can be configurated flexibly as a multi-band LNA that works currently across any different band in the above frequency range. In this work the multiband LNA is designed for 5 GHz wireless LAN and 2.5 GHz Bluetooth standards. The module is implemented with embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. The design is implemented on novel liquid crystal polymer (LCP) substrate. The quality factors of key passive components such as inductors integrated on LCP substrate with thin film technologies is better than 30. The insertion loss of the band pass filter is around 3 dB and return loss is lower than -18 dB. The gain of the wideband LNA is better than 10 dB at frequency range from I GHz to 13 GHz. and its gain is better than 10 dB. The gain of the multi-band LNA is 8.5 dB and noise figure is 5.2 dB on the selected channels.

  • 21.
    Zheng, Li-Rong
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Nejad, Majid B.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Rodriguez Duenas, Saul
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Ismail, Muhammed
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    On-chip versus off-chip passives in radio and mixed-signal system-on-package design2006Inngår i: ESTC 2006 - 1st Electronics Systemintegration Technology Conference, New York: IEEE , 2006, s. 221-232Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Optimal total solution for new radio architecture and implementation requires accurate trade-offs for off-chip versus off-chip passives. In this paper, a complete and systematic design methodology for RF blocks in SoP (system-on-package) versus SoC (system-on-chip) is presented. This methodology explores trade-offs between Performance and cost when different on-chip or off-chip passives are used. For a better presentation, the method and design techniques are demonstrated through four multi-band/multi-standard radio design examples with various technologies and different circuit topologies. Our study reveals that, in order to obtain cost benefits in RF-SoPs, small RF chips should be merged as larger chips and the integration density of each RF chip should be high enough. Our study also indicates that in a complex chip like a multi-band radio, moving passives off chip could achieve further cost savings and significant performance improvements. These are general conclusions but, our method offers a detailed analysis which can give quantitative measurements of cost savings and performance improvements in off-chip versus off-chip passives in RF SoP design.

  • 22.
    Zheng, Li-Rong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Duo, Xinzhong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Shen, Meigen
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Michielsen, Wim
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Cost and performance tradeoff analysis in radio and mixed-signal system-on-package design2004Inngår i: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 27, nr 2, s. 364-375Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    An optimal total solution for radio and mixed-signal system integration needs tradeoffs between different design options. Among various design metrics, cost and performance are probably the two most important factors for design decisions. In this paper, we review and analyze cost-performance tradeoffs of system-on-chip (SOC) versus system-on-Package (SOP) solutions for radio and mixed-signal applications. A new design methodology, which quantitatively predicts performance and cost gains of SOP versus SOC,is presented. The performance model evaluates various mixed-signal isolation techniques between sensitive analog/RF circuits and noisy digital circuits in SOC or SOP. The cost analysis includes new factors such as extra chip area and additional process steps for mixed-signal isolation, seamless integration of "virtual components" or intellectual property (IP) modules, yield and technology compatibility for merging logic, memory and analog/RF circuits on a single chip, and extra costs for moving passives off chip. In addition to these, a complete and systematic analysis method for on-chip versus off-chip passives tradeoffs is presented. The analysis and modeling techniques explore tradeoffs between performance, cost, robustness, and yield when different on-chip or off-chip passives are used. It thus provides a complete picture of quantitative tradeoffs for using on-chip or off-chip passives. The design methodology and analysis techniques are then demonstrated through several design examples in wireless applications. It is clearly shown that for all complex and high performance mixed-signal systems, SOP is a lower cost solution than SOC. Finally,some design guidelines for SOC versus SOP and on-chip versus off-chip are concluded.

  • 23.
    Zheng, Li-Rong
    et al.
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Duo, Xinzhong
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Shen, Meigen
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Torrika, Tommi
    KTH.
    Michielsen, Wim
    KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
    Chen, L.
    Zou, G.
    Liu, J. H.
    Design and implementation of system-on-package for radio and mixed-signal applications2004Inngår i: PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), NEW YORK: IEEE , 2004, s. 97-104Konferansepaper (Fagfellevurdert)
    Abstract [en]

    Emerging wireless applications for logistics, intelligent home networks, smart dusts, wireless body area networks (WBAN) will need integration and fusion of a diversity of technologies, which may include digital CMOS circuits, analog/RF circuits, sensors/MEMS, embedded software and memories, antenna, displays, polymer, packaging and interconnections, new materials and new integration process. System-on-package (SoP) is considered as a promising solution for the fundamental integration platform for such applications. In this paper, we show how SoP technology can address the integration platform for these applications and how this can be done in a better way than system-on-chip integration. We first demonstrate the integration process of, SoP in liquid-crystal polymer materials. We see that liquid-crystal-polymer is a promising material for low cost RF SoP. We then demonstrate some design examples. The first one is an integrated 5GHz RF receiver front-end in liquid crystal polymer. Due to high quality of passive components in SoP, superior RF performance is found in this module. In the second example, we address several critical design issues for on-chip versus off-chip passives in a multi-band multi-standard radio for beyond 3G applications. We find that not only RF performance can be improved. Cost benefits are also obvious for such a complex radio. Chip-package co-design for smart parasitic absorption is demonstrated through an RF module for an ultrawide band radio in gigabit wireless. Concept of a SoP pacemaker in a WBAN is shown. Finally, we discuss some system level integration issues and we show how a system can be smartly partitioned for SoP so that we can obtain an optimal total solution for low-cost and good-performance wireless integration.

  • 24.
    Zheng, Li-Rong
    et al.
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Shen, Meigen
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Duo, Xinzhong
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
    Tenhunen, Hannu
    KTH, Skolan för informations- och kommunikationsteknik (ICT), Elektronik- och datorsystem, ECS.
    Embedded smart systems for intelligent paper and packaging2005Inngår i: 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, s. 1776-1782Konferansepaper (Fagfellevurdert)
    Abstract [en]

    In this paper, we present architecture, circuit implementation and integration issues of an embedded smart system for innovative, long-range interconnected identification/sensor network in warehouse and intelligent goods distribution systems. The network is interconnected via IEEE 802.11 and ultra-wideband (UWB) wireless air interfaces. A self-powered, ultra-low power UWB transceiver with BPSK modulation is designed for transponders and implemented in 0.18um CMOS technology. Low power consumption is achieved by developing innovative circuit and system architectures. Instead of pumping up energy from the Gaussian pluses emitted by the reader, a power converter draws energy from the 802.11 access point and its surrounding electromagnetic waves. Functionality of the transceiver is verified and integration issues for smart labels are investigated on thin foils of liquid crystal polymer.

1 - 24 of 24
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