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Contactless Testing of Circuit Interconnects
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4133-3317
2015 (English)In: Journal of electronic testing, ISSN 0923-8174, E-ISSN 1573-0727, Vol. 31, no 3, 229-253 p.Article in journal (Refereed) Published
Abstract [en]

State-of-the-art printed circuit boards (PCBs) have become extremely dense and are not fully accessible for applying physical testing solutions. Extra steps are required in the design and manufacturing process for testing advanced printed wiring boards (PWBs) with embedded passive components. This processing is further complicated by upcoming sequential build-up (SBU) technologies that provide feature sizes smaller than 10 $\mu$m and that do not allow physical access for testing the interconnect between two pads. In this paper, we propose a new contactless technique for overcoming the SBU challenge for testing interconnects between embedded components. A test trace is employed as a sensor, which senses the terminations of the trace being tested. The simulation and analysis results of this study demonstrate the feasibility of this concept for application to SBU and conventional PCB/PWB interconnect testing to overcome the barriers to physical access. Robustness of the approach has been studied against packaging deviations and possible testing process variations. To ensure defect detection with feasible margins, design for testability (DfT) rules have been established for practical PCB dimensions.

Place, publisher, year, edition, pages
2015. Vol. 31, no 3, 229-253 p.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-10452DOI: 10.1007/s10836-015-5524-6Local ID: 9427db8f-8102-4036-83f7-9e039dc821e3OAI: oai:DiVA.org:ltu-10452DiVA: diva2:983397
Note
Validerad; 2015; Nivå 2; 20140510 (abdren)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2017-11-24Bibliographically approved

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Renbi, AbdelghaniDelsing, Jerker
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