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Application of Contactless Testing to PCBs with BGAs and Open Sockets
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-4133-3317
2015 (English)In: Journal of electronic testing, ISSN 0923-8174, E-ISSN 1573-0727, Vol. 31, no 4, p. 339-347Article in journal (Refereed) Published
Abstract [en]

This paper introduces a practical test method that combines statistics with the contactless test approach. Experiments using real conventional PCBAs have shown the effectiveness of the method, where significant z-scores are obtained to discriminate defective interconnects. The studied test cases involve conventional Printed Circuit Board Assemblies (PCBAs) with open sockets and Ball Grid Array (BGA) packages.

Place, publisher, year, edition, pages
2015. Vol. 31, no 4, p. 339-347
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-3236DOI: 10.1007/s10836-015-5535-3Local ID: 109554c6-25d6-43e1-b12e-41d2ae99d9c7OAI: oai:DiVA.org:ltu-3236DiVA: diva2:976092
Note
Validerad; 2015; Nivå 2; 20140914 (abdren)Available from: 2016-09-29 Created: 2016-09-29 Last updated: 2017-11-24Bibliographically approved

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Renbi, AbdelghaniDelsing, Jerker
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