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Tailoring the interface between dielectric and 4H-SiC by ion implantation
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-8108-2631
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0002-8760-1137
2015 (English)In: Materials Science Forum, ISSN 0255-5476, E-ISSN 1662-9752, Vol. 821-823, 488-491 p.Article in journal (Refereed) Published
Abstract [en]

In this paper, the effect of carbon (C), silicon (Si) and nitrogen (N) implantation on the interface properties of 4H-SiC/SiO2 and the implications for 4H-SiC bipolar junction transistors (BJT) passivation are discussed. 4H-SiC epi-layer have been implanted with12C,14N and28Si ion at three different doses with energies of 3, 3.5 and 6 keV, respectively, resulting in a projected range of 8 nm for the three ions. Then metal oxide semiconductor (MOS) structures with SiO2 as dielectric have been fabricated. Capacitance voltage measurements show an increase in the negative fixed charges for all the implanted samples as a function of implantation induced damage. Similarly, in the case of C and Si, the surface roughness increases as a function of dose and the mass of the ions. No reduction of Dits due to the implantations is seen for any of the ions. Furthermore, TCAD device simulations of npn bipolar junction transistors (BJT), using the interface and fixed charges extracted from CV measurements, show a way to further optimize current gain and breakdown properties for the BJT.

Place, publisher, year, edition, pages
Trans Tech Publications Inc., 2015. Vol. 821-823, 488-491 p.
Keyword [en]
SiC
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Information and Communication Technology
Identifiers
URN: urn:nbn:se:kth:diva-183138DOI: 10.4028/www.scientific.net/MSF.821-823.488Scopus ID: 2-s2.0-84950327328OAI: oai:DiVA.org:kth-183138DiVA: diva2:908106
Conference
ECSCRM 2014
Projects
SSF HOTSiC
Funder
Swedish Foundation for Strategic Research , RE10-0011
Note

QC 20160316

Available from: 2016-03-01 Created: 2016-03-01 Last updated: 2017-11-30Bibliographically approved

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