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Modeling of stresses and deformation in thin film and interconnect line structures
KTH, Superseded Departments, Solid Mechanics.
2001 (English)Doctoral thesis, comprehensive summary (Other scientific)
Place, publisher, year, edition, pages
Stockholm: Hållfasthetslära , 2001. , p. 14
Series
Trita-HFL, ISSN 1104-6813 ; 0294
Keyword [en]
Thin films, thermal stress, theory and modeling, interconnect lines, finite element, texture, copper, unpassivated lines, passivated lines
Identifiers
URN: urn:nbn:se:kth:diva-3224ISBN: OAI: oai:DiVA.org:kth-3224DiVA, id: diva2:9003
Public defence
2001-10-12
Note
NR 20140805Available from: 2001-10-05 Created: 2001-10-05Bibliographically approved

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fulltext(678 kB)942 downloads
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6341db9df8f61c727931c334b63a95feae1d9414885de85358ff15973a3c4321bfd07c08
Type fulltextMimetype application/pdf

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CiteExportLink to record
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  • apa
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