Performance of LTCC embedded gas sensors
2015 (English)In: Procedia Engineering, ISSN 1877-7058, E-ISSN 1877-7058, Vol. 120, 253-256 p.Article in journal (Refereed) Published
A novel approach to encapsulation/packaging of SiC field effect transistor gas sensors for high temperature applications, such as exhaust and fuel gas emissions monitoring, based on direct co-firing of sensor devices and Low-Temperature Co-fired Ceramics (LTCC) has been investigated. Structural (SEM, EDX, XPS), electrical (I/V, C/V) as well as gas sensing characterization of packaged devices has shown that the “one-step” packaging process forms a hermetic package with retained transducer functionality and gas sensing characteristics without the need for any separate die attachment, (wire) bonding, and/or sealing of the package. Long-term stability testing at elevated temperatures of packaged devices has also shown promising results.
Place, publisher, year, edition, pages
2015. Vol. 120, 253-256 p.
Other Chemical Engineering Physical Sciences
IdentifiersURN: urn:nbn:se:liu:diva-124049DOI: 10.1016/j.proeng.2015.08.599OAI: oai:DiVA.org:liu-124049DiVA: diva2:895393