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Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
Blekinge Institute of Technology, Faculty of Engineering, Department of Mechanical Engineering.
2014 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Place, publisher, year, edition, pages
2014. , 45 p.
Keyword [en]
Area array flip chip, Gold bump joint, Thermal mismatch, Thermo mechanical failure
National Category
Other Mechanical Engineering
URN: urn:nbn:se:bth-10918OAI: diva2:867215
Subject / course
MT2517 Master's Thesis (120 credits) in Mechanical Engineering with emphasis on Structural Engineering
Educational program
MTAMT Master of Science Programme in Mechanical Engineering with emphasis on Structural Mechanics
Available from: 2015-11-05 Created: 2015-11-04 Last updated: 2015-11-05Bibliographically approved

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BTH2015Panah(1024 kB)97 downloads
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Type fulltextMimetype application/pdf

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Mohammadi Panah, Mahshid
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Department of Mechanical Engineering
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Total: 97 downloads
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ReferencesLink to record
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