Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE credits
As far as the Printed Circuit Boards (PCB) manufacture industry is concerned, for high production volumes, solder paste is applied on the connection pads through customized stencils. This is a very productive method, yet if the design has to be updated, cost is increasing as the stencil should be changed. For higher exibility, such as in rapid prototyping, jet-printing machines similar to Mycronic MY500 are used. In these equipments, solder paste is jet-printed on the circuit board. The shooting is done by a piston moving on the vertical axis at high speed, hence projecting solder paste onto the connection pads of the PCB.
In order to improve the understanding of the jetting process, it is important to collect data on pressure uctuations in the jetting head. To do so, this project is using a strain gauge to sense the strain applied by the piston on the nozzle. The gauge is connected in a Wheatstone bridge, and the differential signal is extracted and amplified a first time with an instrumentation amplifier. The remaining amplification is then performed with the help of an operational amplifier so that the signal matches the Analog to Digital Converter (ADC) levels. Finally, the converted results are transmitted to a personal computer for further analysis.