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Integrating MEMS and ICs
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES). (Mikrosystemteknik, Microsystem Technology)ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
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2015 (English)In: Microsystems & Nanoengineering, ISSN 2055-7434, Vol. 1, no 1, 1-16 p., 15005Article in journal (Refereed) Published
Abstract [en]

The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the ‘More-Than-Moore’ paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. The implications of the different MEMS and IC integration approaches for packaging, testing and final system costs are reviewed.

Place, publisher, year, edition, pages
2015. Vol. 1, no 1, 1-16 p., 15005
Keyword [en]
Cofabrication platforms, integrated circuits (ICs), microelectromechanical system (MEMS), More-Than-Moore, multichip modules (MCMs), system-in-package (SiP), system-on-chip (SoC), three-dimensional (3D) heterogeneous integration
National Category
Natural Sciences Engineering and Technology
URN: urn:nbn:se:kth:diva-169103DOI: 10.1038/micronano.2015.5OAI: diva2:819950

QC 20150618

Available from: 2015-06-11 Created: 2015-06-11 Last updated: 2016-04-18Bibliographically approved

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Fischer, Andreas C.Forsberg, FredrikLapisa, MartinBleiker, Simon J.Stemme, GöranRoxhed, NiclasNiklaus, Frank
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Micro and NanosystemsSchool of Electrical Engineering (EES)Microsystem Technology (Changed name 20121201)
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