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Development of Through Glass Vias (TGVs) for Interposer Applications
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
2014 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

In this thesis work the manufacturing of through glass vias (TGVs) is presented.

The TGVs were manufactured by adapting technique based on magnetic assembly

developed at KTH for creating through silicon vias (TSVs). TGVs were fabricated

by introducing nickel wires in via-holes that were pre-made on a glass substrate

and applying a spin-on polymer to isolate the nickel wires from the walls of the

via-holes.

Another focus of this work was improving the TGV and TSV manufacturing

process. This was done by investigating the inuence of the assembly speeds on

the yield of the assembly process. Two methods for removing the excess wires left

on the surface of the wafer after the magnetic assembly of the nickel wires were

tested. Also the inuence the pitch between the via-holes has on the yield of the

process was investigated.

Place, publisher, year, edition, pages
2014. , 40 p.
Series
EES Examensarbete / Master Thesis, XR-EE-MST 2014:005
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-165618OAI: oai:DiVA.org:kth-165618DiVA: diva2:808700
Educational program
Master of Science - Embedded Systems
Examiners
Available from: 2015-04-29 Created: 2015-04-29 Last updated: 2015-04-29Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • ieee
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  • Other style
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Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
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  • Other locale
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Output format
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