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Through-thickness mechanical testing and computational modelling of paper and board for efficient materials design
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.). KTH, School of Engineering Sciences (SCI), Centres, VinnExcellence Center BiMaC Innovation.ORCID iD: 0000-0001-8699-7910
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).
2009 (English)Conference paper (Other academic)
Abstract [en]

The objective of most methods for mechanical testing of paper and paperboard is production control, i.e. to secure that the performance of the produced material fulfils certain minimum end‐use requirements. There is in the industry an ever increasing demand for improved efficiency in paper and board converting and end‐use, and this demand paves the way for the development of new test methods that enables a better understanding of the material design. There is a need for better control of changes in the pulping and papermaking processes at different structural levels, and for efficient characterization of these changes. To achieve such control, novel test methods and computational modelling are required.

The objective of this paper is to discuss some newly proposed test methods and to illustrate how these in combination with simulations are a valuable tool for efficient materials design. The mechanical properties that are covered in the paper include in‐plane residual stresses and transverse shear properties of paper and paperboard. The methods will be shortly described and some important experimental results will be presented. Finally, some examples of computation modelling related to these properties will be discussed.

Place, publisher, year, edition, pages
2009. 69-82 p.
National Category
Applied Mechanics Paper, Pulp and Fiber Technology
Research subject
Solid Mechanics
URN: urn:nbn:se:kth:diva-163928OAI: diva2:802661
Hannu Paulapuro Symposium, March 20, 2009, Esbo, Finland

QC 20150413

Available from: 2015-04-13 Created: 2015-04-13 Last updated: 2015-04-13Bibliographically approved

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