Change search
ReferencesLink to record
Permanent link

Direct link
Modeling and experimental validation of the mechanical behavior of pressboard
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).ORCID iD: 0000-0002-7236-6365
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).ORCID iD: 0000-0001-8699-7910
Show others and affiliations
2014 (English)In: Proceedings of the 2014 Electrical Insulation Conference, IEEE conference proceedings, 2014, 203-207 p.Conference paper (Refereed)
Abstract [en]

High density (HD) pressboard is an essential element in power transformers combining good electrical insulation properties with effective mechanical characteristics that well suit design requirements of power transformers. In order to ensure a correctly functioning transformer, it is therefore very important to characterize and to understand the mechanical properties of pressboard under different operating conditions.

Pressboard is composed of natural polymeric chains, whose mechanical properties are affected by moisture and temperature. Moreover, temperature and moisture conditions in power transformers vary throughout manufacturing process and service/operation life-time. An accurate definition of the mechanical properties is, therefore, necessary.

The present article focuses on the effect of different combinations of temperature/moisture and mechanical load on the deformation behavior of HD pressboard samples. A mechanical constitutive model is developed for finite element (FEM) simulation based on a viscoelastic–viscoplastic material description. Special attention is given on the complex through-thickness deformation behavior of HD pressboard. Thorough analyses are performed based on the comparisons between the results of experimental characterization and FEM modeling and simulations. The good agreement between experimental and modeling results shows a great potential for application in mechanical design of transformer insulation.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2014. 203-207 p.
Keyword [en]
Pressboard, Mechanical properties, Temperature–moisture sensitivity, Compressbility test
National Category
Applied Mechanics
Research subject
Solid Mechanics
URN: urn:nbn:se:kth:diva-163903DOI: 10.1109/EIC.2014.6869376ScopusID: 2-s2.0-84906491074OAI: diva2:802645
2014 IEEE Electrical Insulation Conference (EIC),8-11 June 2014, Philadelphia, USA

QC 20150413

Available from: 2015-04-13 Created: 2015-04-13 Last updated: 2015-04-13Bibliographically approved

Open Access in DiVA

fulltext(574 kB)68 downloads
File information
File name FULLTEXT01.pdfFile size 574 kBChecksum SHA-512
Type fulltextMimetype application/pdf

Other links

Publisher's full textScopusIEEEXplore

Search in DiVA

By author/editor
Tjahjanto, Denny D.Östlund, Sören
By organisation
Solid Mechanics (Dept.)
Applied Mechanics

Search outside of DiVA

GoogleGoogle Scholar
Total: 68 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Altmetric score

Total: 44 hits
ReferencesLink to record
Permanent link

Direct link