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Modeling and experimental validation of the mechanical behavior of pressboard
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).ORCID iD: 0000-0002-7236-6365
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).ORCID iD: 0000-0001-8699-7910
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2014 (English)In: Proceedings of the 2014 Electrical Insulation Conference, IEEE conference proceedings, 2014, 203-207 p.Conference paper, Published paper (Refereed)
Abstract [en]

High density (HD) pressboard is an essential element in power transformers combining good electrical insulation properties with effective mechanical characteristics that well suit design requirements of power transformers. In order to ensure a correctly functioning transformer, it is therefore very important to characterize and to understand the mechanical properties of pressboard under different operating conditions.

Pressboard is composed of natural polymeric chains, whose mechanical properties are affected by moisture and temperature. Moreover, temperature and moisture conditions in power transformers vary throughout manufacturing process and service/operation life-time. An accurate definition of the mechanical properties is, therefore, necessary.

The present article focuses on the effect of different combinations of temperature/moisture and mechanical load on the deformation behavior of HD pressboard samples. A mechanical constitutive model is developed for finite element (FEM) simulation based on a viscoelastic–viscoplastic material description. Special attention is given on the complex through-thickness deformation behavior of HD pressboard. Thorough analyses are performed based on the comparisons between the results of experimental characterization and FEM modeling and simulations. The good agreement between experimental and modeling results shows a great potential for application in mechanical design of transformer insulation.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2014. 203-207 p.
Keyword [en]
Pressboard, Mechanical properties, Temperature–moisture sensitivity, Compressbility test
National Category
Applied Mechanics
Research subject
Solid Mechanics
Identifiers
URN: urn:nbn:se:kth:diva-163903DOI: 10.1109/EIC.2014.6869376Scopus ID: 2-s2.0-84906491074OAI: oai:DiVA.org:kth-163903DiVA: diva2:802645
Conference
2014 IEEE Electrical Insulation Conference (EIC),8-11 June 2014, Philadelphia, USA
Note

QC 20150413

Available from: 2015-04-13 Created: 2015-04-13 Last updated: 2015-04-13Bibliographically approved

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Tjahjanto, Denny D.Östlund, Sören
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