Modeling and experimental validation of the mechanical behavior of pressboard
2014 (English)In: Proceedings of the 2014 Electrical Insulation Conference, IEEE conference proceedings, 2014, 203-207 p.Conference paper (Refereed)
High density (HD) pressboard is an essential element in power transformers combining good electrical insulation properties with effective mechanical characteristics that well suit design requirements of power transformers. In order to ensure a correctly functioning transformer, it is therefore very important to characterize and to understand the mechanical properties of pressboard under different operating conditions.
Pressboard is composed of natural polymeric chains, whose mechanical properties are affected by moisture and temperature. Moreover, temperature and moisture conditions in power transformers vary throughout manufacturing process and service/operation life-time. An accurate definition of the mechanical properties is, therefore, necessary.
The present article focuses on the effect of different combinations of temperature/moisture and mechanical load on the deformation behavior of HD pressboard samples. A mechanical constitutive model is developed for finite element (FEM) simulation based on a viscoelastic–viscoplastic material description. Special attention is given on the complex through-thickness deformation behavior of HD pressboard. Thorough analyses are performed based on the comparisons between the results of experimental characterization and FEM modeling and simulations. The good agreement between experimental and modeling results shows a great potential for application in mechanical design of transformer insulation.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2014. 203-207 p.
Pressboard, Mechanical properties, Temperature–moisture sensitivity, Compressbility test
Research subject Solid Mechanics
IdentifiersURN: urn:nbn:se:kth:diva-163903DOI: 10.1109/EIC.2014.6869376ScopusID: 2-s2.0-84906491074OAI: oai:DiVA.org:kth-163903DiVA: diva2:802645
2014 IEEE Electrical Insulation Conference (EIC),8-11 June 2014, Philadelphia, USA
QC 201504132015-04-132015-04-132015-04-13Bibliographically approved