Electromagnetic signatures as a tool for Connectionless Test (CT)
2002 (English)Conference paper, Abstract (Other academic)
Today’s electronic products and subassemblies are highly integrated, miniaturized devices having complex functionality. Final test and troubleshooting using conventional test points, probes and bed-of-nails techniques are becoming harder, and are in many cases not even possible. Further, due to increasing production volumes, the time needed for testing is a critical factor. An alternative way to test a device is to employ Connectionless Test (CT). The idea is to measure the electromagnetic (EM) field surrounding the DeviceUnder Test (DUT) during different modes of operation.Using the CAD data for the DUT, an Electromagnetic signature can be created from the measured EM data.The obtained signature is matched to earlier signatures stored in an adaptive database that is being updated continuously. The database not only contains signatures from “known good” devices, but also signatures obtained from some typical failure types. In this way, the DUT can be classified as working properly, suffering from a previously known type of failure or having a “new”, hitherto unknown malfunction. Since the electromagnetic signature also contains spatial information, it is an interesting tool in thetroubleshooting process. Besides the type of failure, an estimate of the location of the problem may be extracted from the signature. Initial practical tests have shown that the CT method outlined above works for both “analog” as well as “digital” electronic products having medium complexity.
Place, publisher, year, edition, pages
New Jersey: IEEE Computer Society, 2002.
, Test Technology Technical Council
Connectionless test, board test
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:oru:diva-40038OAI: oai:DiVA.org:oru-40038DiVA: diva2:774715
IEEE Board Test Workshop 2002, Baltimore, USA