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Effects of 3-MeV Protons on 4H-SiC Bipolar Devices and Integrated OR-NOR Gates
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-6459-749X
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-8108-2631
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2014 (English)In: IEEE Transactions on Nuclear Science, ISSN 0018-9499, E-ISSN 1558-1578, Vol. 61, no 4, 1772-1776 p.Article in journal (Refereed) Published
Abstract [en]

Radiation effects of 3-MeV protons on 4H-SiC bipolar devices and integrated OR-NOR gates have been investigated. The chips were irradiated from a fluence of 1 x 10(8) cm(-2) until 1 x 10(13) cm(-2). Up until a fluence of 1 x 10(11) cm-2, both the bipolar devices and the logic gates were found to be stable, but for higher fluence, they begin to degrade as a function of irradiation fluence. Using TCAD simulations, degradation of the transistor current gain has been found to be more dominated by surface states than bulk defects generated by the proton irradiation. Simulations of logic circuits using SPICE show that the gain degradation is the key contribution to the unstable performance of the circuits from the fluence of 1 x 10(12) cm(-2) and above.

Place, publisher, year, edition, pages
2014. Vol. 61, no 4, 1772-1776 p.
Keyword [en]
4H-SiC, bipolar integrated circuits, emitter couple logic (ECL), OR-NOR gates, proton radiation
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-156460DOI: 10.1109/TNS.2014.2310293ISI: 000343928100038Scopus ID: 2-s2.0-84906780937OAI: oai:DiVA.org:kth-156460DiVA: diva2:767390
Conference
European Conference on Radiation and its Effects on Components and Systems (RADECS), SEP 23-27, 2013, Oxford, ENGLAND
Funder
Swedish Foundation for Strategic Research
Note

QC 20141201

Available from: 2014-12-01 Created: 2014-11-28 Last updated: 2017-12-05Bibliographically approved
In thesis
1. Radiation Hardness of 4H-SiC Devices and Circuits
Open this publication in new window or tab >>Radiation Hardness of 4H-SiC Devices and Circuits
2017 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Advances in space and nuclear technologies are limited by the capabilities of the conventional silicon (Si) electronics. Hence, there is a need to explore materials beyond Si with enhanced properties to operate in extreme environments. In this regards, silicon carbide (4H-SiC), a wide bandgap semiconductor, provides suitable solutions. In this thesis, radiation effects of 4H-SiC bipolar devices, circuits and dielectrics for SiC are investigated under various radiation types. We have demonstrated for the first time the radiation hardness of 4H-SiC logic circuits exposed to extremely high doses (332 Mrad) of gamma radiation and protons. Comparisons with previously available literature show that our 4H-SiC bipolar junction transistor (BJT) is 2 orders of magnitude more tolerant under gamma radiation to existing Si-technology. 4H-SiC devices and circuits irradiated with 3 MeV protons show about one order of magnitude higher tolerance in comparison to Si.

Numerical simulations of the device showed that the ionization is most influential in the degradation process by introducing interface states and oxide charges that lower the current gain. Due to the gain reduction of the BJT, the voltage reference of the logic circuit has been affected and this, in turn, degrades the voltage transfer characteristics of the OR-NOR gates.

One of the key advantages of 4H-SiC over other wide bandgap materials is the possibility to thermally grow silicon oxide (SiO2) and process device in line with advanced silicon technology. However, there are still questions about the reliability of SiC/SiO2 interface under high power, high temperature and radiation rich environments. In this regard, aluminium oxide (Al2O3), a chemically and thermally stable dielectric, has been investigated. It has been shown that the surface cleaning treatment prior to deposition of a dielectric layer together with the post dielectric annealing has a crucial effect on interface and oxide quality. We have demonstrated a new method to evaluate the interface between dielectric/4H-SiC utilizing an optical free carrier absorption technique to quantitative measure the charge carrier trapping dynamics. The radiation hardness of Al2O3/4H-SiC is demonstrated and the data suggests that Al2O3 is better choice of dielectric for devices in radiation rich applications.

Place, publisher, year, edition, pages
KTH Royal Institute of Technology, 2017. 56 p.
Series
TRITA-ICT, 2017:04
Keyword
Silicon carbide, radiation hardness, protons, gamma radiation, bipolar junction transistors, aluminium oxide, surface recombination.
National Category
Engineering and Technology
Research subject
Information and Communication Technology
Identifiers
urn:nbn:se:kth:diva-199907 (URN)978-91-7729-252-4 (ISBN)
Public defence
2017-02-17, Ka-Sal C (Sal Sven-Olof Öhrvik), KTH, Kistagången 16, Kista, 10:00 (English)
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Supervisors
Note

QC 20170119

Available from: 2017-01-19 Created: 2017-01-17 Last updated: 2017-01-19Bibliographically approved

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