Thermomechanical stability and integrability of an embedded ceramic antenna with an integrated sensor element for wireless reading in harsh environments
2013 (English)In: Journal of Physics: Conference Series: Volume 476 / [ed] Paul Mitcheson and Steve Beeby, 2013Conference paper (Refereed)
This paper reports on the design, manufacturing and evaluation of a small, wirelessly powered and read resonating antenna circuit with an integrated pressure sensor. The work aims at developing miniature devices suitable for harsh environments, where high temperature prevents the use of conventional, silicon-based microdevices. Here, the device is made of alumina with platinum as conducting material. Ceramic green tapes were structured using high-precision milling, metallized using screen printing, and subsequently laminated to form stacks before they were sintered. The device's frequency shift as a function of temperature was studied up to 900°C. The contributions to the shift both from the thermomechanical deformation of the device at large, and from the integrated and, so far, self-pressurized sensor were sorted out. A total frequency shift of 3200 ppm was observed for the pressure sensor for heating over the whole range. Negligible levels of thermally induced radius of curvature were observed. With three-point bending, a frequency shift of 180 ppm was possible to induce with a curvature of radius of 220 m at a 10 N load. The results indicate that a robust pressure sensor node, which can register pressure changes of a few bars at 900°C and wirelessly transmit the signal, is viable.
Place, publisher, year, edition, pages
Wireless pressure sensor, harsh environment, high temperature, ceramic embedding
Research subject Engineering Science with specialization in Microsystems Technology
IdentifiersURN: urn:nbn:se:uu:diva-212358DOI: 10.1088/1742-6596/476/1/012055ISI: 000329347500054OAI: oai:DiVA.org:uu-212358DiVA: diva2:677244
The 13th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2013)3–6 December 2013, London, UK