ROBUST MICRODEVICE MANUFACTURING BY DIRECT LITHOGRAPHY AND ADHESIVE-FREE BONDING OF OFF-STOICHIOMETRY THIOL-ENE-EPOXY (OSTE+) POLYMER
2013 (English)In: 17th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems & EUROSENSORS XXVII (IEEE TRANSDUCERS 2013), IEEE conference proceedings, 2013, 408-411 p.Conference paper (Refereed)
We here demonstrate, for the first time, the use of direct lithography in off-stoichiometry thiol-ene-epoxy (OSTE+) to fabricate a microdevice. First, the photolithographic property of OSTE+ is shown by using a photomask to create micropillars with an aspect-ratio of 1:10 in a 2 mm thick layer. Secondly, a three-layer OSTE+ microdevice containing in-/outlet holes, channels, and pillars is fabricated by using a combination of direct lithography and adhesive-free dry bonding. The resulting microdevice shows desirable properties, such as leak-free filling and hydrophilic surfaces. This fabrication method enhances the microstructurability of OSTE+ beyond that of conventional soft lithography replica molding of other polymers, such as PDMS.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2013. 408-411 p.
Bonding, epoxy, microdevice fabrication, Microfluidics, OSTE+, photolithography, soft lithography, thiol, thiol-ene
Polymer Technologies Nano Technology
IdentifiersURN: urn:nbn:se:kth:diva-124782DOI: 10.1109/Transducers.2013.6626789ScopusID: 2-s2.0-84891691276ISBN: 978-146735981-8OAI: oai:DiVA.org:kth-124782DiVA: diva2:638583
17th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems & EUROSENSORS XXVII (IEEE TRANSDUCERS 2013), Barcelona, Spain, 16-20 Jun, 2013
QC 201402122013-07-312013-07-312015-06-03Bibliographically approved