Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration
2013 (English)In: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, New York: IEEE , 2013, 381-384 p.Conference paper (Refereed)
Thin wafer handling is an important issue in 3D integration technologies. This paper reports on an efficient method for bonding a thin wafer and debonding it at room temperature from a carrier wafer. This method addresses the major problem of fragility and flexibility in handling of thin wafers used in TSV fabrication. In the presented method the carrier wafer is spin coated with an electrochemically active polymer adhesive. It is then bonded to a device wafer. The wafer stack is thinned and finally released from the carrier wafer by applying a voltage.
Place, publisher, year, edition, pages
New York: IEEE , 2013. 381-384 p.
, Proceedings IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
IdentifiersURN: urn:nbn:se:kth:diva-108302DOI: 10.1109/MEMSYS.2013.6474258ISI: 000320549200098ScopusID: 2-s2.0-84875412516ISBN: 978-1-4673-5654-1OAI: oai:DiVA.org:kth-108302DiVA: diva2:579880
IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013
FunderEU, European Research Council, 267528
QC 201301072013-01-242012-12-202013-08-22Bibliographically approved