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Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9008-8402
KTH, School of Information and Communication Technology (ICT), Integrated Devices and Circuits.ORCID iD: 0000-0001-6459-749X
Show others and affiliations
2012 (English)In: 12th IEEE Conference on Nanotechnology (IEEE-NANO), 2012, IEEE conference proceedings, 2012, 1-4 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper we report a method for layer-by-layer printing of three-dimensional (3D) silicon (Si) micro- and nanostructures. This fabrication method is based on a sequence of alternating steps of chemical vapor deposition of Si and local implantation of gallium (Ga+) ions by focused ion beam (FIB) writing. The defined 3D structures are formed in a final step by selectively wet etching the non-implanted Si in potassium hydroxide (KOH). We demonstrate the viability of the method by fabricating 2 and 3-layer 3D Si structures, including suspended beams and patterned lines with dimensions on the nm-scale.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2012. 1-4 p.
Keyword [en]
3D silicon patterning, 3D Si printing, focused ion beam (FIB) writing, ion implantation, microstructures, nanostructures, MEMS, NEMS
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-105842DOI: 10.1109/NANO.2012.6322048ISI: 000309933900163Scopus ID: 2-s2.0-84869188480ISBN: 978-1-4673-2198-3 (print)OAI: oai:DiVA.org:kth-105842DiVA: diva2:572474
Conference
2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO),The International Conference Centre Birmingham,20-23 August 20112, Birmingham, United Kingdom
Projects
M&Ms
Funder
EU, European Research Council, 277879
Note

QC 20130110

Available from: 2013-01-10 Created: 2012-11-27 Last updated: 2013-11-12Bibliographically approved

Open Access in DiVA

fulltext(1317 kB)286 downloads
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File name FULLTEXT02.pdfFile size 1317 kBChecksum SHA-512
bc87c8e74985582da2a2a2899395839335e964cc5b3eedee6775ecaecae052603ff08f1cc35beece7691d326818bb3f0eb504636f47677dc7659ffdaa275f5eb
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Publisher's full textScopushttp://dx.doi.org/10.1109/NANO.2012.6322048

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Fischer, Andreas C.Gylfason, Kristinn B.Belova, Lyubov M.Malm, Gunnar B.Radamson, Henry H.Kolahdouz, M.Stemme, GöranNiklaus, Frank
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Microsystem Technology (Changed name 20121201)Integrated Devices and Circuits
Other Electrical Engineering, Electronic Engineering, Information Engineering

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CiteExportLink to record
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