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An evaluation of the temperature dependence of cohesive properties for two structural epoxy adhesives
University of Skövde, School of Technology and Society. (Mechanics of Materials)
University of Skövde, School of Technology and Society.
University of Skövde, School of Technology and Society.
2012 (English)In: 19th European Conference on Fracture, Kazan Scientific Centre of the Russian Academy of Sciences , 2012Conference paper, Published paper (Refereed)
Abstract [en]

Cohesive modelling provides a more detailed understanding of the fracture properties of adhesivejoints than provided by linear elastic fracture mechanics. A cohesive model is characterized by astress-deformation relation of the adhesive layer. This relation can be measured experimentally.Two parameters of the stress-deformation relation are of special importance; the area under thecurve, which equals the fracture energy, and the peak stress. The influence of temperature of theseparameters is analyses experimentally and evaluated statistically for two structural epoxy adhesivesin the span from of -40°C to +80°C. The adhesives are used by the automotive industry and atemperature span below the glass transition temperature is considered. The results show that thattemperature has a modest influence on the adhesives Mode I fracture energy. For one of theadhesives, the fracture energy is independent of the temperature in the evaluated temperature span.In mode II, the influence of temperature is larger. The peak stresses decreases almost linearly withan increasing temperature in both loading cases and for both adhesives.

Place, publisher, year, edition, pages
Kazan Scientific Centre of the Russian Academy of Sciences , 2012.
Keyword [en]
Double cantilever beam, End notched flexure, Fracture energy, Kruskal-Wallis test, Peak stress, Regression analyses.
National Category
Mechanical Engineering
Research subject
Technology
Identifiers
URN: urn:nbn:se:his:diva-6400ISBN: 978-5-905576-18-8 OAI: oai:DiVA.org:his-6400DiVA: diva2:553362
Conference
19th European Conference on Fracture, Kazan, Russia, Aug. 26-31 2012
Available from: 2012-10-10 Created: 2012-09-19 Last updated: 2017-11-27Bibliographically approved
In thesis
1. Cohesive modelling of the temperature dependence of epoxy based adhesives in Mode I and Mode II loading
Open this publication in new window or tab >>Cohesive modelling of the temperature dependence of epoxy based adhesives in Mode I and Mode II loading
2013 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

In this work, the influence of the temperature on the cohesive laws for two epoxy adhesives is studied at temperatures below the glass transition temperature for both Mode I and Mode II loading. Cohesive laws are measured experimentally under quasi-static loading conditions in the temperature range -30≤T≤80"C" . Three parameters of the cohesive laws are studied in detail: the elastic stiffness, the peak stress and the fracture energy. Methods for determining the elastic stiffness in Mode I and Mode II are derived and evaluated. With these methods, the results in this work show that it is possible to measure all three parameters for each pure mode loading case by the use of only the DCB- and the ENF-test specimens. Even though the measures tend to spread in values, this can significantly reduce the cost for performing experiments. It is shown that most of the cohesive parameters are decreasing with an increasing temperature in both loading modes and for both adhesives. An exception is the Mode I fracture energy for one of the adhesives. This is shown to be independent of the temperature in the studied temperature range. For the same adhesive, the Mode II fracture energy is shown to be continuously decreasing with an increasing temperature. The experimental results are verified by finite element analyses. The simulations only consider uncoupled cohesive behaviours. By use of the experimental results, simplified bi-linear cohesive laws to be used at any temperature within the studied temperature range are derived for one adhesive in both loading modes. This is desired in order to simulate adhesively bonded structures that suffer a wide range in temperature.

Place, publisher, year, edition, pages
Göteborg: Chalmers University of Technology, 2013. iii, 6 s. (tot 48) p.
Series
Thesis for licentiate of engineering, ISSN 1652-8565 ; 2013:08
Keyword
Cohesive laws, Epoxy adhesive, Fracture energy, Peak stress, Temperature, Regression analyses, Shear modulus, Young’s modulus.
National Category
Materials Engineering
Research subject
Technology
Identifiers
urn:nbn:se:his:diva-8390 (URN)
Presentation
2013-04-04, Gamma/Delta, 10:00
Opponent
Supervisors
Note

Ett av två delarbeten (övrigt se rubriken Delarbeten):

Paper A:

Walander, T., Biel, A. and Stigh, U., “Temperature dependence of cohesive laws for an epoxy adhesive in Mode I and Mode II loading”. Submitted

Available from: 2013-08-12 Created: 2013-08-12 Last updated: 2017-11-27Bibliographically approved

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