Wafer-level heterogeneous 3D integration for MEMS and NEMS
2012 (English)In: Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, IEEE conference proceedings, 2012, 247-252 p.Conference paper (Refereed)
In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2012. 247-252 p.
MEMS, microelectromechanical system, More-than-Moore, nano-electromechanical system, NEMS, self-assembly, transfer printing, wafer-level heterogeneous integration
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-101501DOI: 10.1109/LTB-3D.2012.6238096ScopusID: 2-s2.0-84864852130ISBN: 978-146730742-0OAI: oai:DiVA.org:kth-101501DiVA: diva2:550631
3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012; Tokyo;22 May 2012 through 23 May 2012
QC 201209072012-09-072012-08-302015-03-19Bibliographically approved