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Wafer-level heterogeneous 3D integration for MEMS and NEMS
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-6731-3886
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2012 (English)In: Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, IEEE conference proceedings, 2012, 247-252 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2012. 247-252 p.
Keyword [en]
MEMS, microelectromechanical system, More-than-Moore, nano-electromechanical system, NEMS, self-assembly, transfer printing, wafer-level heterogeneous integration
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-101501DOI: 10.1109/LTB-3D.2012.6238096Scopus ID: 2-s2.0-84864852130ISBN: 978-146730742-0 (print)OAI: oai:DiVA.org:kth-101501DiVA: diva2:550631
Conference
3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012; Tokyo;22 May 2012 through 23 May 2012
Note

QC 20120907

Available from: 2012-09-07 Created: 2012-08-30 Last updated: 2015-03-19Bibliographically approved

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Niklaus, FrankLapisa, MartinBleiker, Simon J.Dubois, ValentinRoxhed, NiclasFischer, AndreasForsberg, FredrikStemme, Göran
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