Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers
2012 (English)In: 2012 MRS Spring Meeting - Symposium L – Group IV Photonics for Sensing and Imaging, Materials Research Society, 2012Conference paper (Other academic)
Semiconductor-based thermistors are very attractive sensor materials for uncooled thermal infrared (IR) bolometers. Very large scale heterogeneous integration of MEMS is an emerging technology that allows the integration of epitaxially grown, high-performance IR bolometer thermistor materials with pre-processed CMOS-based integrated circuits for the sensor read-out. Thermistor materials based on alternating silicon (Si) and silicon-germanium (SiGe) epitaxial layers have been demonstrated and their performance is continuously increasing. Compared to a single layer of silicon or SiGe, the temperature coefficient of resistance (TCR) can be strongly enhanced to about 3 %/K, by using thin alternating layers. In this paper we report on the optimization of alternating Si/SiGe layers by advanced physically based simulations, including quantum mechanical corrections. Our simulation framework provides reliable predictions for a wide range of SiGe layer compositions, including concentration gradients. Finally, our SiGe thermistor layers have been evaluated in terms of low-frequency noise performance, in order to optimize the bolometer detectivity.
Place, publisher, year, edition, pages
Materials Research Society, 2012.
, MRS Online Proceedings Library, ISSN 1946-4274 ; 1437
semiconducting, sensor, bonding
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-91415DOI: 10.1557/opl.2012.1324ScopusID: 2-s2.0-84879264122OAI: oai:DiVA.org:kth-91415DiVA: diva2:510013
2012 MRS Spring Meeting & Exhibit, Symposium L,April 9-13, 2012 San Francisco, California
QC 201301112012-03-142012-03-142015-04-17Bibliographically approved