Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates
2012 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 22, no 5, 055025- p.Article in journal (Refereed) Published
This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding tool. The efficient placement and alignment functions of the wire-bonding tool are used to mechanically attach the wire to deep-etched silicon anchoring and clamping structures. This approach enables a reliable and accurate integration of wire materials that cannot be wire bonded by traditional means.
Place, publisher, year, edition, pages
Institute of Physics Publishing (IOPP), 2012. Vol. 22, no 5, 055025- p.
Bonding, Electromechanical devices, Integration, MEMS
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-90858DOI: 10.1088/0960-1317/22/5/055025ISI: 000303197000025ScopusID: 2-s2.0-84860433128OAI: oai:DiVA.org:kth-90858DiVA: diva2:506935
FunderEU, European Research Council, 267528 277879
QC 201205282012-04-202012-03-012012-12-07Bibliographically approved