Co-design of flip chip interconnection with anisotropic conductive adhesives and inkjet-printed circuits for paper-based RFID tags
2011 (English)In: 2011 61st Electronic Components and Technology Conference, ECTC 2011, IEEE conference proceedings, 2011, 1752-1757 p.Conference paper (Other academic)
In this paper we study the radio frequency performance of interconnect using anisotropic conductive film (ACF). A series of experiments are conducted in order to measure and model the electrical characteristics of inkjet-printed circuits on paper substrate as well as the impedance parameters of ACF interconnect at high frequency. Four-point measurement structure, time domain reflectometry (TDR), vector network analyzer (VNA) and de-embedded technology are used to ensure the accuracy of experiments. Equivalent circuit models are built based on the experimental results. Finally, these models are considered as parts of the matching network and circuit design for the RFID receiver, which can be co-designed for developing paper-based electronic systems. It is found that since the difference between RFID tags with and without ACF interconnects is negligible, the influence of ACF interconnects can be ignored for paper-based UHF RFID tag. ACF is a feasible interconnect material for paper-based RFID tags.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2011. 1752-1757 p.
, Electronic Components and Technology Conference, ISSN 0569-5503
ACF interconnect;RFID receiver;anisotropic conductive adhesives;anisotropic conductive film;circuit design;de-embedded technology;electrical characteristics;equivalent circuit model;flip chip interconnection codesign;four-point measurement structure;impedance parameter;inkjet-printed circuit;interconnect material;matching network;paper substrate;paper-based UHF RFID tag;paper-based electronic system;radio frequency performance;time domain reflectometry;vector network analyzer;flip-chip devices;radiofrequency identification;
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-49208DOI: 10.1109/ECTC.2011.5898749ISI: 000302341400267ScopusID: 2-s2.0-79960436784OAI: oai:DiVA.org:kth-49208DiVA: diva2:459397
Electronic Components and Technology Conference. Lake Buena Vista, FL. 31 May 2011 - 3 June 2011
QC 201111292011-11-252011-11-252015-11-13Bibliographically approved