Dry Transfer Bonding of Porous Silicon Membranes to OSTE(+) Polymer Microfluidic Devices
2012 (English)In: Proceedings IEEE International Conference on Micro Electro MechanicalSystems (MEMS), IEEE , 2012, 232-234 p.Conference paper (Refereed)
We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.
Place, publisher, year, edition, pages
IEEE , 2012. 232-234 p.
, Proceedings IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
Fluidic devices, Polymers, Porous silicon
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-49010DOI: 10.1109/MEMSYS.2012.6170133ISI: 000312912800059ScopusID: 2-s2.0-84860477442ISBN: 978-978-1-4673-0325-5OAI: oai:DiVA.org:kth-49010DiVA: diva2:459129
25th IEEE International Conference on Micro Electro Mechanical Systems, Paris, France, January, 2012
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