Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0441-6893
Show others and affiliations
2011 (English)In: Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, IEEE , 2011, 37-40 p.Conference paper, Published paper (Refereed)
Abstract [en]

Three-dimensional (3D) integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies using through silicon vias (TSVs). They enable the realization of devices with shorter signal lengths, smaller packages and lower parasitic capacitances, which can result in higher performance and lower costs of the system. This paper presents a novel low-cost fabrication technique for solid metal-filled TSVs using nickel wires as conductive path. The wires are placed in the via hole of a silicon wafer by magnetic self-assembly. This metal filling technique enables through-wafer vias with high aspect ratios and potentially eliminates characteristic cost drivers of the TSV production such as metallization processes, wafer thinning and general issues associated with thin-wafer handling.

Place, publisher, year, edition, pages
IEEE , 2011. 37-40 p.
Series
Proceedings: IEEE micro electro mechanical systems, ISSN 1084-6999
Keyword [en]
3D integration;Ni;Si;conductive path;electronics and-or MEMS-based transducer;high aspect ratio through silicon via fabrication;low-cost fabrication technique;lower parasitic capacitance;magnetic self-assembly;metal filling technique;metallization process;nickel wire;shorter signal length;solid metal-filled TSV;thin-wafer handling;three-dimensional integration;through-wafer via;vertically interconnect stacked die;electronics packaging;integrated circuit interconnections;integrated circuit metallisation;microfabrication;micromechanical devices;nickel;silicon;three-dimensional integrated circuits;wires;
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-47427DOI: 10.1109/MEMSYS.2011.5734356ISI: 000295841200010Scopus ID: 2-s2.0-79953801879ISBN: 978-1-4244-9632-7 (print)OAI: oai:DiVA.org:kth-47427DiVA: diva2:455236
Note
© 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. QC 20111110Available from: 2011-11-10 Created: 2011-11-09 Last updated: 2011-11-15Bibliographically approved

Open Access in DiVA

fulltext(2755 kB)2247 downloads
File information
File name FULLTEXT01.pdfFile size 2755 kBChecksum SHA-512
a2e377d79f0d9c4ae8e595a03b925611fa1fdc45c3888b81b111e3bcd97d54d0cf26e1d57df42739cc1ddb7f24c7527b79fd2759a181865326182530ee0062bb
Type fulltextMimetype application/pdf

Other links

Publisher's full textScopusPublished version

Search in DiVA

By author/editor
Fischer, Andreas C.Roxhed, NiclasHaraldsson, TommyStemme, GöranNiklaus, Frank
By organisation
Microsystem Technology
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar
Total: 2247 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 132 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf