Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps
2011 (English)In: Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers), IEEE , 2011, 1360-1363 p.Conference paper (Other academic)
This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.
Place, publisher, year, edition, pages
IEEE , 2011. 1360-1363 p.
Bonding, Cavity resonators, Force, Gold, Silicon, Substrates, Wires
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-47359DOI: 10.1109/TRANSDUCERS.2011.5969522ScopusID: 2-s2.0-80052111264OAI: oai:DiVA.org:kth-47359DiVA: diva2:454852
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QC 201111102011-11-102011-11-082011-11-10Bibliographically approved