On the deposition rate in a high power pulsed magnetron sputtering discharge
2006 (English)In: Applied Physics Letters, ISSN 0003-6951, E-ISSN 1077-3118, Vol. 89, no 15, 154104- p.Article in journal (Refereed) Published
The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density I-Tpd of up to 570 mA cm(-2), HPPMS and dcMS deposition rates are equal. For I-Tpd greater than 570 mA cm(-2), optical emission spectroscopy shows a pronounced increase of the Cr+/Cr-0 signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed.
Place, publisher, year, edition, pages
American Institute of Physics (AIP) , 2006. Vol. 89, no 15, 154104- p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-71504DOI: 10.1063/1.2362575ISI: 000241247900142OAI: oai:DiVA.org:liu-71504DiVA: diva2:450290