Deformation and damage mechanisms in IN792 during thermomechanical fatigue
2011 (English)In: Materials Science & Engineering: A, ISSN 0921-5093, Vol. 528, no 13-14, 4658-4668 p.Article in journal (Refereed) Published
The deformation and damage mechanisms arising during thermomechanical fatigue (TMF) of the polycrystallinesuperalloy IN792 have been investigated. The TMF cycles used in this study are in-phase(IP) and out-of-phase (OP). The minimum temperature used in all TMF-tests is 100 ◦C while the maximumtemperature is 500 or 750 ◦C in the IP TMF-tests and 750, 850 or 950 ◦C in the OP TMF-tests. Themajority of the cracks are transcrystalline, except for the IP TMF-test at 750 ◦C, where some tendencyto intercrystalline crack growth can be seen. In all tests, the cracks were initiated and propagated inlocations where deformation structures such as deformation bands have formed in the material. In thetemperature interval 750–850 ◦C, twins were formed in both IP and OP TMF-tests and this behaviouris observed to be further enhanced close to a crack. Twins are to a significantly lesser extent observedfor tests with a lower (500 ◦C) and a higher (950 ◦C) maximum temperature. Recrystallization at grainboundaries, around particles and within the deformation structures have occurred in the OP TMF-testswith a maximum temperature of 850 and 950 ◦C and this is more apparent for the higher temperature.Void formation is frequently observed in the recrystallized areas even for the case of compressive stressesat high temperature.
Place, publisher, year, edition, pages
Elsevier , 2011. Vol. 528, no 13-14, 4658-4668 p.
Nickel based superalloys, Fatigue, Shear bands, Recrystallization, Twinning
Engineering and Technology Other Materials Engineering
IdentifiersURN: urn:nbn:se:liu:diva-67259DOI: 10.1016/j.msea.2011.02.063ISI: 000290004200051OAI: oai:DiVA.org:liu-67259DiVA: diva2:408900
Jan Kanesund, Johan Moverare and Sten Johansson, Deformation and damage mechanisms in IN792 during thermomechanical fatigue, 2011, Materials Science & Engineering: A, (528), 13-14, 4658-4668.
Copyright: Elsevier Science B.V., Amsterdam.