Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
Show others and affiliations
2010 (English)In: MEMS 2010: (MEMS), 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems, IEEE , 2010, 472-475 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre- treatments or metal oxide etches are required. This enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nickel plating baths.

Place, publisher, year, edition, pages
IEEE , 2010. 472-475 p.
Series
PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
Keyword [en]
contact resistance, electroless deposition, micromechanical devices, nickel, plasma deposited coatings
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24738DOI: 10.1109/MEMSYS.2010.5442462ISI: 000278416400116Scopus ID: 2-s2.0-77952750384ISBN: 978-1-4244-5761-8 (print)OAI: oai:DiVA.org:kth-24738DiVA: diva2:356823
Conference
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
Note
© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.QC 20101014Available from: 2011-11-10 Created: 2010-09-27 Last updated: 2011-11-22Bibliographically approved

Open Access in DiVA

fulltext(4458 kB)3557 downloads
File information
File name FULLTEXT01.pdfFile size 4458 kBChecksum SHA-512
cd260ed95fc52910869af273a9e169f44cc1ab2e2fd53230905c1919ea8a4ec5930234e0f2b90f1f4e8abd8a4cd617b9900b8c1b84858e7b1579ee2771dbdf22
Type fulltextMimetype application/pdf

Other links

Publisher's full textScopusPublished version

Search in DiVA

By author/editor
Fischer, Andreas C.Lapisa, MartinRoxhed, NiclasStemme, GöranNiklaus, Frank
By organisation
Microsystem Technology
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
Total: 3558 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 151 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf