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Micromachined Waveguide Interposer for the Characterization of Multi-port Sub-THz Devices
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-8894-7930
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2020 (English)In: Journal of Infrared, Millimeter and Terahertz Waves, ISSN 1866-6892, E-ISSN 1866-6906Article in journal (Refereed) Published
Abstract [en]

This paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220–330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.

Place, publisher, year, edition, pages
2020.
Keywords [en]
Waveguide, Silicon micromachining, Terahertz, Multi-port, Measurement, Interposer, Test-fixture, DRIE, Orthomode transducer
National Category
Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-266451DOI: 10.1007/s10762-019-00663-4OAI: oai:DiVA.org:kth-266451DiVA, id: diva2:1384798
Note

QC 20200113

Available from: 2020-01-10 Created: 2020-01-10 Last updated: 2020-01-13Bibliographically approved

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Publisher's full texthttps://link.springer.com/article/10.1007%2Fs10762-019-00663-4

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