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Micro Assembly for Radio Frequency Electronics: Characterization of Bond Wires
KTH, School of Electrical Engineering and Computer Science (EECS).
2019 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

Due to the increasing number of components involved in Radio Frequency design, integration and packaging become an important topic of developing power-efficient and cost-effective solutions. Furthermore, interconnections are a key factor in such a topic because they are heavily used in Radio Frequency engineering, especially in the Fifth Generation. Among the interconnections, bond wires are one of the most commonly used.In micro assembly design, it is crucial to understand and model the behavior of each component, including interconnections. Radio Frequency engineers usually use the bond wire models in the software directly without questioning if the model actually has the same behavior as the fabricated one. Therefore, how to accurately model and characterize the bond wires becomes valuable, and furthermore, how the physical dimensions affect the transmission performance. This Master’s thesis project aims to solve this problem by building simple models for single bond wire and double bond wires with coupling, and verifying them by electromagnetic simulation and measurement.The project has built bond wire models in Matlab and in electromagnetic simulators NI AWR and ANSYS HFSS. The actual test structures are also fabricated using the bonding machine, and measured by vector network analyzer. A sufficient amount of data has been collected from these sources and then analyzed. The proposed analytical model of bond wires is valid after comparing its results with those from simulation and measurement. In addition, the effect of the loop height and separation distance on the transmission performance is studied and has a well verified conclusion.This thesis work will be helpful to Radio Frequency engineers, who use bond wires in the micro assembly of their design. They would be able to characterize the bond wires more accurately and adjust the physical dimensions in order to achieve the desired performance.

Abstract [sv]

På grund av det ökande antalet komponenter i radiofrekvensdesign, integration och förpackning blivit ett viktigt ämne för att utveckla energieffektiva och kostnadseffektiva lösningar. Sammankopplingar är en nyckelfaktor i ett sådant ämne, eftersom de är starkt används i radiofrekvensteknik. Bland dem, bondtrådar är en av de vanligaste.Det är viktigt att förstå och modellera beteendet hos varje komponent. Därför hur att noggrant modellera och karakterisera bondtrådarna blir ett värdefullt problem, och dessutom, hur de fysiska dimensionerna påverkar överföringsprestanda.Projektet har byggt bondtrådsmodeller i Matlab och i elektromagnetiska simulatorer NI AWR och ANSYS HFSS. De faktiska teststrukturerna tillverkas också med hjälp av bindningsmaskinen och mäts av vektornätverksanalysatorn. Den föreslagna analysmodellen för bindningstrådar är giltig efter att ha jämfört dess resultat med dem från simulering och mätning. Dessutom studeras effekten av slinghöjden och separationsavståndet på transmissionens prestanda och har en väl verifierad slutsats.

Place, publisher, year, edition, pages
2019. , p. 53
Series
TRITA-EECS-EX ; 2019:554
Keywords [en]
Bond wire interconnection, Radio frequency, Analytical model, Electromagnetic simulation, Electromagnetic measurement
Keywords [sv]
Bindningstråd sammankoppling, Radiofrekvens, Analytisk modell, Elektromagnetisk simulering, Elektromagnetisk mätning
National Category
Computer and Information Sciences
Identifiers
URN: urn:nbn:se:kth:diva-257875OAI: oai:DiVA.org:kth-257875DiVA, id: diva2:1349111
External cooperation
Huawei Technologies Sweden AB
Supervisors
Examiners
Available from: 2019-09-06 Created: 2019-09-06 Last updated: 2019-09-06Bibliographically approved

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