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Improving the morphological stability of nickel germanide by tantalum and tungsten additions
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.ORCID iD: 0000-0003-2679-2387
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
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2018 (English)In: Applied Physics Letters, ISSN 0003-6951, E-ISSN 1077-3118, Vol. 112, no 10Article in journal (Refereed) Published
Abstract [en]

To enhance the morphological stability of NiGe, a material of interest as a source drain-contact in Ge-based field effect transistors, Ta or W, is added as either an interlayer or a capping layer. The efficacy of this Ta or W addition is evaluated with pure NiGe as a reference. While interlayers increase the NiGe formation temperature, capping layers do not retard the NiGe formation. Regardless of the initial position of Ta or W, the morphological stability of NiGe against agglomeration can be improved by up to 100 °C. The improved thermal stability can be ascribed to an inhibited surface diffusion, owing to Ta or W being located on top of NiGe after annealing, as confirmed by means of transmission electron microscopy, Rutherford backscattering spectrometry, and atom probe tomography. The latter also shows a 0.3 €‰at. % solubility of Ta in NiGe at 450 °C, while no such incorporation of W is detectable.

Place, publisher, year, edition, pages
2018. Vol. 112, no 10
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:uu:diva-344676DOI: 10.1063/1.5019440OAI: oai:DiVA.org:uu-344676DiVA, id: diva2:1188264
Funder
Swedish Foundation for Strategic Research , SE13- 0033Swedish Foundation for Strategic Research , RIF14- 0053Swedish Research Council, C0514401Available from: 2018-03-07 Created: 2018-03-07 Last updated: 2018-05-18Bibliographically approved

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