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Micromachined Multilayer Bandpass Filter at 270 GHz Using Dual-Mode Circular Cavities
KTH, School of Electrical Engineering (EES), Micro and Nanosystems. (RF MEMS)
KTH, School of Electrical Engineering (EES), Micro and Nanosystems. (RF MEMS)
KTH, School of Electrical Engineering (EES), Micro and Nanosystems. (RF MEMS)ORCID iD: 0000-0001-5662-6748
KTH, School of Electrical Engineering (EES), Micro and Nanosystems. (RF MEMS)ORCID iD: 0000-0002-8514-6863
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2017 (English)In: 2017 IEEE MTT-S International Microwave Symposium, IEEE conference proceedings, 2017, p. 1449-1452, article id 8058894Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present a microfabricated fourth-order sub-THz WR-3.4 bandpass waveguide filter based on TM110 dual-mode circular-shaped cavity resonators. The filter operates at the center frequency of 270 GHz with fractional bandwidth of 1.85% and two transmission zeros are introduced in the upper and in the lower stopband using a virtual negative coupling. The microchip filter is significantly more compact than any previous dual-mode designs at comparable frequencies, occupying less than 1.5 mm2. Furthermore, in contrast to any previous micromachined filter work, due to its axially arranged interfaces it can be directly inserted between two standard WR-3.4 rectangular-waveguide flanges, which vastly improves system integration as compared to previous micromachined filters; in particular no custom-made split-block design is required. The cavities are etched in the handle layer of a silicon-on-insulator (SOI) wafer, and coupling is realized through rectangular slots fabricated in the SOI device layer. Couplings of the degenerate modes in one cavity are facilitated by means of small perturbations in the circular cavity shapes. The measured average return loss in the passband is –18 dB and worst-case return loss is –15 dB, and an insertion loss of only 1.5 dB was measured. The excellent agreement between measured and simulated data is facilitated by fabrication accuracy, design robustness and micromachined self-alignment geometries.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2017. p. 1449-1452, article id 8058894
Series
IEEE MTT-S International Microwave Symposium Digest, ISSN 0149645X
Keywords [en]
subTHz filter, dual-mode filters, waveguide filters, microfabrication, micromachining technology
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-217394DOI: 10.1109/MWSYM.2017.8058894ISI: 000425241500389Scopus ID: 2-s2.0-85032500946ISBN: 978-1-5090-6360-4 (print)OAI: oai:DiVA.org:kth-217394DiVA, id: diva2:1156326
Conference
2017 IEEE MTT-S International Microwave Symposium, IMS 2017, Honololu, United States, 4 June 2017 through 9 June 2017
Funder
Swedish Foundation for Strategic Research , SE13-007EU, European Research Council, 616846
Note

QC 20171120

Available from: 2017-11-12 Created: 2017-11-12 Last updated: 2018-03-23Bibliographically approved

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