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Micromachined Cavity Resonator Sensors for on Chip Material Characterisation in the 220–330 GHz band
Uppsala Universitet.ORCID iD: 0000-0002-2217-8032
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0001-5662-6748
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-8264-3231
Uppsala Universitet.ORCID iD: 0000-0003-2401-2981
Show others and affiliations
2017 (English)In: Proceedings of the 47th European Microwave Conference, Nuremberg, October 8-13, 2017, 2017Conference paper, Published paper (Refereed)
Abstract [en]

A silicon micromachined waveguide on-chip sensor for J-band (220-325 GHz) is presented. The sensor is based on a micromachined cavity resonator provided with an aperture in the top side of a hollow waveguide for sensing purposes. The waveguide is realized by microfabrication in a silicon wafer, goldmetallized and assembled by thermocompression bonding. The sensor is used for measuring the complex relative permittivity of different materials. Preliminary measurements of several dielectric materials are performed, demonstrating the potential of the sensor and methodology.

Place, publisher, year, edition, pages
2017.
Keyword [en]
THz, micromachined waveguides, millimeter-wave, submillimeter-wave, sensors, on-chip
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-216957OAI: oai:DiVA.org:kth-216957DiVA: diva2:1152608
Conference
European Microwave Conference 2017
Projects
SSF Swedish Foundation for Strategic Research, Synergy Grant Electronics SEl3-007
Funder
Swedish Foundation for Strategic Research , SEl3-007
Note

QCR 20171031

Available from: 2017-10-25 Created: 2017-10-25 Last updated: 2017-10-31Bibliographically approved

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CiteExportLink to record
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