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Inkjet printing technology for increasing the I/O density of 3D TSV interposers
KTH, School of Electrical Engineering (EES), Micro and Nanosystems. Silex Microsystems AB.
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2017 (English)In: Microsystems & Nanoengineering, E-ISSN 2055-7434‎, Vol. 3, p. 17002-Article in journal (Refereed) Published
Abstract [en]

Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.

Place, publisher, year, edition, pages
Nature Publishing Group, 2017. Vol. 3, p. 17002-
Keywords [en]
heterogeneous three-dimensional (3D) integration; inkjet printing; interposer; microelectromechanical system (MEMS); reliability; super inkjet (SIJ); through silicon via (TSV)
National Category
Nano Technology
Identifiers
URN: urn:nbn:se:kth:diva-206166DOI: 10.1038/micronano.2017.2ISI: 000399297500001OAI: oai:DiVA.org:kth-206166DiVA, id: diva2:1091740
Note

QC 20170510

Available from: 2017-04-27 Created: 2017-04-27 Last updated: 2017-05-10

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Publisher's full texthttps://www.nature.com/articles/micronano20172

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