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Ablation of Si with femtosecond laser
KTH, School of Electrical Engineering (EES).
2016 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

Femtosecond laser ablation of different materials is becoming more and more important in micro- and nanomachining fields. The cutting precision and cost-effectiveness related to this method are turning it into a valid alternative to traditional methods. Coupling it with PDMS-assisted microtransfer printing could establish a completely new process of fabrication. In this work, ablation parameters were optimized to cut square shapes (sometimes referred to as “inks”) on the silicon device layer of a thin-film SOI (silicon-on-insulator) wafer. Specifically, the effect of repetition rate, power, number of passes, feed rate and cutting direction was investigated. A scanning electron microscope was used to determine the quality of the cuts. Qualitatively, the ablated lines were in accordance with results reported in the available literature but with smaller cut width due to the smaller spot size.  After etching of the buried oxide, PDMS retrieval of the inks was attempted. While not entirely successful, the results were promising for further investigation.

Abstract [sv]

Karvning i olika material med en femtosekundlaser blir en alltmer betydelsefull tillvägagångs sätt inom fabrikations processer i mikro och nanostorlek. Skärprecisionen och kostnadseffektiviteten som följer med denna metod gör detta till ett bra alternativ gentemot traditionella metoder. Kombinera denna metod med förflyttning av strukturer med hjälp av PDMS så kan en helt ny fabrikationsprocess etableras inom tillverkning av mikro och nanostrukturer. I detta projekt så optimeras fabrikations parametrar för att skära kvadratiska former (så kallade ”inks”) i kisel lagret på SOI (kisel-på-isolator) skivor. Mer specifikt så analyserades effekten av repetitionshastigheten, kraften, antal passager, matningshastighet och skärriktningen. Ett elektronmikroskop användes för att döma kvaliteten av snitten som utfördes med denna metod. Kvalitativt sätt så var de utskurna linjerna i enlighet med tidigare resultat som har rapporterats inom den tillgängliga litteraturen men med mindre snittbredd på grund av den mindre punktstorleken. Efter att man etsat bort det underliggande oxidlagret så gjordes det försök med att plocka upp ”inks” med hjälp av PDMS-material. Fast än dessa försök inte blev full så framgångsrika så gav de ändå lovande resultat för framtida forskning.

Place, publisher, year, edition, pages
2016. , 52 p.
Series
EES Examensarbete / Master Thesis, TRITA-EE 2016:156
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-196217OAI: oai:DiVA.org:kth-196217DiVA: diva2:1046331
Examiners
Available from: 2016-11-14 Created: 2016-11-14 Last updated: 2016-11-15Bibliographically approved

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