Ultrasonic imaging of thin layers within multi-layered structures
2008 (English)In: 2008 IEEE International Ultrasonics Symposium: IUS ; Beijing, China, 2 - 5 November 2008, New York: IEEE Communications Society, 2008, 828-831 p.Conference paper (Refereed)
In the area of process control, non-destructive testing (NDT) using ultrasound is valuable due to its noninvasive properties. In process control, imaging of surface profiles is used to locate defects or problematic areas in order to quickly steer the manufacturing process on track again. This paper presents a method for imaging of parallel thin layers within multi-layered structures. Due to the application in process control a parametric model is used, and all subsequent analysis is performed on the model parameters rather than on the signal waveforms, resulting in a necessary data reduction. The parameters in the model are directly connected to physical properties, such as the reflection coefficients, time-of-flights, and attenuation coefficients. Experimental results shows that the estimated model parameters can be used in imaging of thin layer properties within the material structure. Images of embedded layers with a thickness about the wavelength is shown. Result also show that flaws can be detected in such structures. The results are verified by comparing the images to visual inspections of photographs.
Place, publisher, year, edition, pages
New York: IEEE Communications Society, 2008. 828-831 p.
, I E E E International Ultrasonics Symposium. Proceedings, ISSN 1051-0117
Research subject Signal Processing
IdentifiersURN: urn:nbn:se:ltu:diva-38672DOI: 10.1109/ULTSYM.2008.0199Local ID: d1f8bdc0-48d0-11dd-a9fb-000ea68e967bISBN: 978-1-4244-2428-3OAI: oai:DiVA.org:ltu-38672DiVA: diva2:1012173
IEEE International Ultrasonics Symposium : 02/11/2008 - 05/11/2008
Validerad; 2008; 20080703 (johanc)2016-10-032016-10-03Bibliographically approved