Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Single Chip Wireless Condition Monitoring of Power Semiconductor Modules
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.ORCID iD: 0000-0002-8216-832X
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
Luleå University of Technology, Department of Computer Science, Electrical and Space Engineering, Embedded Internet Systems Lab.
2015 (English)In: Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015, Piscataway, NJ: IEEE Communications Society, 2015, 7364407Conference paper, Published paper (Refereed)
Abstract [en]

A concept for doing accurate monitoring of temperature in power semiconductor modules is proposed. The concept involves glueing wireless single-chip temperature sensors with on-chip coils in direct contact with power semiconductor devices within their modules. Direct contact results in accurate temperature measurements while wireless technology such as RFID provides galvanic isolation from the power devices. An overview of the electromagnetic situation within wire bond power semiconductor modules is presented and a prototype chip with an on-chip coil has been manufactured as an initial attempt to investigate the feasibility of the concept. Measurements on said chip provides some insight in the challenges in on-chip coil designs. The feasibility of the concept is supported by earlier work that have demonstrated high power transfer efficiencies and a low power temperature sensor that is able to operate at high temperatures.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Communications Society, 2015. 7364407
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Industrial Electronics
Identifiers
URN: urn:nbn:se:ltu:diva-28555DOI: 10.1109/NORCHIP.2015.7364407Local ID: 262849d9-384e-4db1-a463-d5b45ad7f229ISBN: 978-1-4673-6576-5 (electronic)OAI: oai:DiVA.org:ltu-28555DiVA: diva2:1001755
Conference
Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015 : 26/10/2015 - 28/10/2015
Note
Validerad; 2016; Nivå 1; 20160111 (joanil)Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2017-11-25Bibliographically approved

Open Access in DiVA

fulltext(183 kB)118 downloads
File information
File name FULLTEXT01.pdfFile size 183 kBChecksum SHA-512
d6ebd7e988f64d47b1353484eee8f0568de9f9ab4d7ac14c8bd73ed52f6e32bc933778dd54702907916599d3061b253d53b0836083f03bde300ae35405e86cf5
Type fulltextMimetype application/pdf

Other links

Publisher's full text

Authority records BETA

Nilsson, JoakimBorg, JohanJohansson, Jonny

Search in DiVA

By author/editor
Nilsson, JoakimBorg, JohanJohansson, Jonny
By organisation
Embedded Internet Systems Lab
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
Total: 118 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 231 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf