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Electrospun chitosan nanofiber random mats reinforced with cellulose nanowhiskers: Poster Presentation
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Material Science.
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Material Science.ORCID iD: 0000-0003-4762-2854
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Material Science.ORCID iD: 0000-0001-8909-3554
2013 (English)Conference paper, Poster (with or without abstract) (Refereed)
Abstract [en]

Chitosan is a non-toxic, antibacterial, biodegradable and biocompatible biopolymer used extensively for biomedical applications such as tissue engineering, drug and gene delivery, wound healing etc. Electrospinning of chitosan solution in acetic acid (50%) was carried out at 25 kV, gap distance of 155 mm, flow rate 13 mL/h. Cellulose nanowhiskers having diameters of 5-10 nm and aspect ratio of ≈150, were isolated from microcrystalline cellulose (MCC) and used as the reinforcement in the electrospun random mats. The mats were further crosslinked using genipin to improve mechanical properties. The electrospun fibers had diameters in the range of 130-300 nm. With inclusion of the whiskers decreased 50% of average fiber diameters. The mechanical properties of electrospun mats increased as a function of nanowhisker addition as well as crosslinking. These electrospun mats are expected to find application in wound dressing, burn healing etc.

Place, publisher, year, edition, pages
2013.
National Category
Bio Materials
Research subject
Wood and Bionanocomposites
Identifiers
URN: urn:nbn:se:ltu:diva-28027Local ID: 1ac7849d-21db-45d4-886e-9d239efc13eeOAI: oai:DiVA.org:ltu-28027DiVA, id: diva2:1001220
Conference
EEIGM International Conference on Advanced materials research : 21/03/2013 - 22/03/2013
Note
Godkänd; 2013; 20130925 (andbra)Available from: 2016-09-30 Created: 2016-09-30 Last updated: 2017-11-25Bibliographically approved

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Naseri, NargesOksman, KristiinaMathew, Aji P.
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