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Chip-package codesign of receiver front end modules for RF/wireless applications
Amin, Yasar
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
ORCID iD:
0000-0003-4968-993X
Tenhunen, Hannu
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
ORCID iD:
0000-0003-1959-6513
Jamal, Habibullah
Zheng, Li-Rong
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
ORCID iD:
0000-0001-9588-0239
Duo, Xinzhong
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
Show others and affiliations
2005 (English)
In:
2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, New York: IEEE , 2005, p. 767-770
Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
New York: IEEE , 2005. p. 767-770
National Category
Telecommunications
Identifiers
URN:
urn:nbn:se:kth:diva-43141
DOI:
10.1109/WCACEM.2005.1469698
ISI:
000232402200185
Scopus ID:
2-s2.0-33745005531
ISBN:
0-7803-9068-7 (print)
OAI: oai:DiVA.org:kth-43141
DiVA, id:
diva2:448238
Conference
IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics. Honolulu, HI. APR 03-07, 2005
Note
QC 20111014
Available from:
2011-10-14
Created:
2011-10-13
Last updated:
2024-01-08
Bibliographically approved
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Amin, Yasar
Tenhunen, Hannu
Zheng, Li-Rong
Duo, Xinzhong
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ieee
modern-language-association-8th-edition
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apa
ieee
modern-language-association-8th-edition
vancouver
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en-GB
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