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Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
KTH, Tidigare Institutioner, Mikroelektronik och informationsteknik, IMIT.
KTH, Tidigare Institutioner, Elektroniksystemkonstruktion.
2004 (engelsk)Inngår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, NEW YORK: IEEE , 2004, s. 75-78Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. As well, influence of lossy packaging parasitics on LNA is also analyzed.

sted, utgiver, år, opplag, sider
NEW YORK: IEEE , 2004. s. 75-78
HSV kategori
Identifikatorer
URN: urn:nbn:se:kth:diva-25010ISI: 000225765800018Scopus ID: 2-s2.0-15944383087ISBN: 0-7803-8667-1 (tryckt)OAI: oai:DiVA.org:kth-25010DiVA, id: diva2:354967
Konferanse
13th Topical Meeting on Electrical Performance of Electronic Packaging Portland, OR, OCT 25-27, 2004
Merknad
QC 20101005Tilgjengelig fra: 2010-10-05 Laget: 2010-10-05 Sist oppdatert: 2012-02-14bibliografisk kontrollert
Inngår i avhandling
1. System-on-package solutions for multi-band RF front end
Åpne denne publikasjonen i ny fane eller vindu >>System-on-package solutions for multi-band RF front end
2005 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization.

The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained.

Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.

sted, utgiver, år, opplag, sider
Stockholm: KTH, 2005. s. ix, 88
Serie
Trita-IMIT. LECS, ISSN 1651-4076 ; 2005:08
Emneord
chip-package co-design, multi-band radio, system-on-package
HSV kategori
Identifikatorer
urn:nbn:se:kth:diva-482 (URN)91-7178-187-0 (ISBN)
Disputas
2005-11-25, Sal D, KTH-Forum, 10:00
Opponent
Veileder
Merknad
QC 20101005Tilgjengelig fra: 2005-11-09 Laget: 2005-11-09 Sist oppdatert: 2010-10-05bibliografisk kontrollert

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