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On-chip versus off-chip passives in radio and mixed-signal system-on-package design
KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
KTH, Skolan för informations- och kommunikationsteknik (ICT), Mikroelektronik och Informationsteknik, IMIT.
Vise andre og tillknytning
2006 (engelsk)Inngår i: ESTC 2006 - 1st Electronics Systemintegration Technology Conference, New York: IEEE , 2006, s. 221-232Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

Optimal total solution for new radio architecture and implementation requires accurate trade-offs for off-chip versus off-chip passives. In this paper, a complete and systematic design methodology for RF blocks in SoP (system-on-package) versus SoC (system-on-chip) is presented. This methodology explores trade-offs between Performance and cost when different on-chip or off-chip passives are used. For a better presentation, the method and design techniques are demonstrated through four multi-band/multi-standard radio design examples with various technologies and different circuit topologies. Our study reveals that, in order to obtain cost benefits in RF-SoPs, small RF chips should be merged as larger chips and the integration density of each RF chip should be high enough. Our study also indicates that in a complex chip like a multi-band radio, moving passives off chip could achieve further cost savings and significant performance improvements. These are general conclusions but, our method offers a detailed analysis which can give quantitative measurements of cost savings and performance improvements in off-chip versus off-chip passives in RF SoP design.

sted, utgiver, år, opplag, sider
New York: IEEE , 2006. s. 221-232
Emneord [en]
Bandwidth, Cost effectiveness, Integrated circuit layout, Passive networks, Radio communication
HSV kategori
Identifikatorer
URN: urn:nbn:se:kth:diva-25002DOI: 10.1109/ESTC.2006.280002ISI: 000241425800033Scopus ID: 2-s2.0-42549084691ISBN: 1-4244-0552-1 (tryckt)ISBN: 978-142440552-7 OAI: oai:DiVA.org:kth-25002DiVA, id: diva2:354930
Konferanse
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006
Merknad

QC 20101005

Tilgjengelig fra: 2010-10-05 Laget: 2010-10-05 Sist oppdatert: 2014-11-26bibliografisk kontrollert
Inngår i avhandling
1. System-on-package solutions for multi-band RF front end
Åpne denne publikasjonen i ny fane eller vindu >>System-on-package solutions for multi-band RF front end
2005 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization.

The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained.

Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.

sted, utgiver, år, opplag, sider
Stockholm: KTH, 2005. s. ix, 88
Serie
Trita-IMIT. LECS, ISSN 1651-4076 ; 2005:08
Emneord
chip-package co-design, multi-band radio, system-on-package
HSV kategori
Identifikatorer
urn:nbn:se:kth:diva-482 (URN)91-7178-187-0 (ISBN)
Disputas
2005-11-25, Sal D, KTH-Forum, 10:00
Opponent
Veileder
Merknad
QC 20101005Tilgjengelig fra: 2005-11-09 Laget: 2005-11-09 Sist oppdatert: 2010-10-05bibliografisk kontrollert

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