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Adhesive Wafer Bonding for Heterogeneous System Integration
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0001-6731-3886
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-8853-0967
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-0080-0708
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2018 (English)In: ECS Meeting Abstracts / [ed] The Electrochemical Society, 2018Conference paper, Oral presentation with published abstract (Refereed)
Place, publisher, year, edition, pages
2018.
Keywords [en]
Adhesive wafer bonding, Wafer bonding, Integration, Hetergeneous integration, MEMS, NEMS, CMOS
National Category
Manufacturing, Surface and Joining Technology Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-253894OAI: oai:DiVA.org:kth-253894DiVA, id: diva2:1327458
Conference
Americas International Meeting on Electrochemistry and Solid State Science (AiMES 2018)
Note

QC 20190624

Available from: 2019-06-19 Created: 2019-06-19 Last updated: 2019-06-24Bibliographically approved

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Bleiker, Simon J.Dubois, Valentin J.Schröder, StephanOttonello Briano, FloriaGylfason, Kristinn B.Stemme, GöranNiklaus, Frank
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Manufacturing, Surface and Joining TechnologyOther Electrical Engineering, Electronic Engineering, Information Engineering

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