A task-oriented cyber-physical system in manufacturing
2018 (English)In: Proceedings of International Conference on Computers and Industrial Engineering, CIE, Curran Associates Inc. , 2018Conference paper, Published paper (Refereed)
Abstract [en]
Towards automatic operations on a shop floor, this paper proposes a task-oriented cyber-physical system (CPS) concept, called holonic CPS. Within the context, operation processes are separated and modelled independently, and machines are also divided into hardware and basic controllers. The elementary distributed entities from operation processes and machines are represented by holons including “Cyber” and “Physical” parts. A holon is designed in hierarchical structure involving agent, FB, controller and hardware from top to bottom, and a holarchy, a holonic network including relevant holons, is able to represent a task or a function on the shop floor. To show how the proposed holonic CPS works, a robotic application is designed, in which both assembly tasks and machining (grinding and polishing) tasks can be performed. Where a set of relevant holons and holarchies are presented, which provide a “library” as the basis to represent an ordered task. A microkernel architecture is designed to implement the holonic CPS. A major benefit under the holonic CPS allows the partial manufacturing operation to be transferred into computing issues.
Place, publisher, year, edition, pages
Curran Associates Inc. , 2018.
Keywords [en]
Cyber-physical system, Holon, Robot control, Task oriented, Computer hardware, Embedded systems, Floors, Grinding (machining), Robotic assembly, Cyber-physical systems (CPS), Grinding and polishing, Hierarchical structures, Manufacturing operations, Robot controls, Robotic applications, Task-oriented, Cyber Physical System
National Category
Computer Systems
Identifiers
URN: urn:nbn:se:kth:diva-247413Scopus ID: 2-s2.0-85061328597OAI: oai:DiVA.org:kth-247413DiVA, id: diva2:1313088
Conference
48th International Conference on Computers and Industrial Engineering, CIE 2018, 2 December 2018 through 5 December 2018
Note
QC20190502
2019-05-022019-05-022022-06-26Bibliographically approved