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Low-Loss Silicon Micromachined Waveguides Above 100 GHz Utilising Multiple H-plane Splits
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0001-5662-6748
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-8514-6863
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0002-8264-3231
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2018 (English)In: Proceedings of the 48th European Microwave Conference, Madrid, October 1-3, 2018, Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1041-1044, article id 8541605Conference paper, Published paper (Refereed)
Abstract [en]

For sub-millimeter and millimeter wave applications rectangular waveguides are an ideal transmission medium. Compared to conventional, metal-milled rectangular waveguides, silicon micromachined waveguides offer a number of advantages. In this paper we present a low-loss silicon micromachined waveguide technology based on a double H-plane split for the frequency bands of 110 – 170 GHz and 220 – 330 GHz. For the upper band a reduced height waveguide is presented, which achieves a loss per unit length of 0.02 – 0.10 dB/mm. This technology has been further adapted to implement a full height waveguide for the lower frequency band of 110 – 170 GHz. The full height waveguide takes advantage of the benefits of the double H-plane split technique to overcome the challenges of fabricating micromachined waveguides at lower frequencies. With measured insertion loss of 0.007 – 0.013 dB/mm, averaging 0.009 dB/mm over the whole band, this technology offers the lowest insertion loss of any D-band waveguide to date. The unloaded Q factor of the D-band waveguide technology is estimated to be in excess of 1600, while a value of 750 has been measured for the reduced height upper band waveguide.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 1041-1044, article id 8541605
Keywords [en]
RF MEMS, micromachined waveguide, rectangular waveguide, submillimeter-wave
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-237448DOI: 10.23919/EuMC.2018.8541605Scopus ID: 2-s2.0-85059802681ISBN: 9782874870514 (print)OAI: oai:DiVA.org:kth-237448DiVA, id: diva2:1259127
Conference
48th European Microwave Conference, EuMC 2018, Madrid, Spain, 25 September 2018 through 27 September 2018
Funder
Swedish Foundation for Strategic Research , SEl3-007EU, European Research Council, 616846EU, Horizon 2020, 644039
Note

QC 20181029

Available from: 2018-10-27 Created: 2018-10-27 Last updated: 2019-01-24Bibliographically approved

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CiteExportLink to record
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