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Temperature-Gradient Based Test Scheduling for 3D Stacked ICs
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
2013 (English)In: 2013 IEEE International Conference on Electronics, Circuits, and Systems, IEEE conference proceedings, 2013, 405-408 p.Conference paper, Published paper (Refereed)
Abstract [en]

Defects that are dependent on temperature-gradients (e.g., delay-faults) introduce a challenge for achieving an effective test process, in particular for 3D ICs. Testing for such defects must be performed when the proper temperature gradients are enforced on the IC, otherwise these defects may escape the test. In this paper, a technique that efficiently heats up the IC during test so that it complies with the specified temperature gradients is proposed. The specified temperature gradients are achieved by applying heating sequences to the cores of the IC under test trough test access mechanism; thus no external heating mechanism is required. The scheduling of the test and heating sequences is based on thermal simulations. The schedule generation is guided by functions derived from the IC's temperature equation. Experimental results demonstrate that the proposed technique offers considerable test time savings.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2013. 405-408 p.
National Category
Computer Science
Identifiers
URN: urn:nbn:se:liu:diva-106740DOI: 10.1109/ICECS.2013.6815440ISI: 000339725900110ISBN: 978-1-4799-2452-3 (print)OAI: oai:DiVA.org:liu-106740DiVA: diva2:718368
Conference
20th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2013), Abu Dhabi, United Arab Emirates, December 9-12, 2013
Available from: 2014-05-20 Created: 2014-05-20 Last updated: 2014-08-28Bibliographically approved

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CiteExportLink to record
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