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Process-Variation Aware Multi-temperature Test Scheduling
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
2014 (English)In: 27th International Conference on VLSI Design and 13th International Conference on Embedded Systems, IEEE conference proceedings, 2014, 32-37 p.Conference paper, Published paper (Refereed)
Abstract [en]

Chips manufactured with deep sub micron technologies are prone to large process variation and temperature-dependent defects. In order to provide high test efficiency, the tests for temperature-dependent defects should be applied at appropriate temperature ranges. Existing static scheduling techniques achieve these specified temperatures by scheduling the tests, specially developed heating sequences, and cooling intervals together. Because of the temperature uncertainty induced by process variation, a static test schedule is not capable of applying the tests at intended temperatures in an efficient manner. As a result the test cost will be very high. In this paper, an adaptive test scheduling method is introduced that utilizes on-chip temperature sensors in order to adapt the test schedule to the actual temperatures. The proposed method generates a low cost schedule tree based on the variation statistics and thermal simulations in the design phase. During the test, a chip selects an appropriate schedule dynamically based on temperature sensor readings. A 23% decrease in the likelihood that tests are not applied at the intended temperatures is observed in the experimental studies in addition to 20% reduction in test application time.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2014. 32-37 p.
Series
International Conference on VLSI Design. Proceedings, ISSN 1063-9667
National Category
Computer Science
Identifiers
URN: urn:nbn:se:liu:diva-106739DOI: 10.1109/VLSID.2014.13ISI: 000350732700015Scopus ID: 2-s2.0-84894553976OAI: oai:DiVA.org:liu-106739DiVA: diva2:718367
Conference
27th International Conference on VLSI Design and 13th International Conference on Embedded Systems, Mumbai, India, January 5-9, 2014
Available from: 2014-05-20 Created: 2014-05-20 Last updated: 2015-06-01Bibliographically approved

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Aghaee Ghaleshahi, NimaPeng, ZeboEles, Petru

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