Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
An Efficient Temperature-Gradient Based Burn-In Technique for 3D Stacked ICs
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology.
2014 (English)In: Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014, IEEE conference proceedings, 2014Conference paper, Published paper (Refereed)
Abstract [en]

Burn-in is usually carried out with high temperature and elevated voltage. Since some of the early-life failures depend not only on high temperature but also on temperature gradients, simply raising up the temperature of an IC is not sufficient to detect them. This is especially true for 3D stacked ICs, since they have usually very large temperature gradients. The efficient detection of these early-life failures requires that specific temperature gradients are enforced as a part of the burn-in process. This paper presents an efficient method to do so by applying high power stimuli to the cores of the IC under burn-in through the test access mechanism. Therefore, no external heating equipment is required. The scheduling of the heating and cooling intervals to achieve the required temperature gradients is based on thermal simulations and is guided by functions derived from a set of thermal equations. Experimental results demonstrate the efficiency of the proposed method.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2014.
National Category
Computer Science
Identifiers
URN: urn:nbn:se:liu:diva-106738DOI: 10.7873/DATE2014.142ISI: 000354965500129ISBN: 978-3-9815370-2-4 (print)OAI: oai:DiVA.org:liu-106738DiVA: diva2:718366
Conference
Design, Automation and Test in Europe Conference and Exhibition (DATE 2014), Dresden, Germany, March 24-28, 2014
Available from: 2014-05-20 Created: 2014-05-20 Last updated: 2015-06-22

Open Access in DiVA

No full text

Other links

Publisher's full textLink to paperLink to paper

Search in DiVA

By author/editor
Aghaee Ghaleshahi, NimaPeng, ZeboEles, Petru
By organisation
ESLAB - Embedded Systems LaboratorySoftware and SystemsThe Institute of Technology
Computer Science

Search outside of DiVA

GoogleGoogle Scholar

Altmetric score

Total: 259 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf